| Allicdata Part #: | ATS31075-ND |
| Manufacturer Part#: |
ATS-18H-200-C2-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-200-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.56580 |
| 10 +: | $ 3.47004 |
| 25 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an increasingly important factor in electronics design; as systems become smaller and faster, efficient heat dissipation is essential to ensure system reliability and to prevent products from overheating. The ATS-18H-200-C2-R0 is an ideal thermally managed solution for a variety of applications. It features two rows of through-hole insertable pins for high current devices and an integrated fan for additional heat dissipation.
The ATS-18H-200-C2-R0 heatsink is suitable for use in a wide range of applications, from power amplifier circuits to motor drivers, audio amplifiers, battery charging systems, and general electronic components that require a high level of thermal management. It is also suitable for use in laser diodes, where high frequency laser pulses require additional cooling.
The ATS-18H-200-C2-R0 heatsink works on the principle of forced convection cooling, whereby air is forced through gap between the heatsink housing and the component. The air passes through the fins on the heatsink, which increases the air speed and, in turn, its cooling capacity. The integrated fan provides additional air speed and helps to further cool the component. The airflow generated by the fan is dynamic, which ensures that the cooling is effective and efficient.
The ATS-18H-200-C2-R0 heatsink can be mounted easily on the PCB board using two rows of through-hole pins. The pins are designed to ensure a secure grip on the board and a reliable connection between the component and the heatsink. They also ensure that the air gap between the component and the heatsink is minimized, allowing the best possible thermal management. The heatsink also features a thermal pad to help dissipate heat away from the component and further optimize heat dissipation.
The design of the ATS-18H-200-C2-R0 heatsink is optimized for thermal management and offers an efficient and reliable solution to a range of applications. The combination of the pin grid and the fan ensures the efficient and effective cooling of the component, ensuring reliable performance and system reliability. This heatsink is an ideal choice for a variety of applications where thermal management is of paramount importance.
The specific data is subject to PDF, and the above content is for reference