| Allicdata Part #: | ATS31078-ND |
| Manufacturer Part#: |
ATS-18H-203-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-203-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 4.21000 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
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The ATS-18H-203-C2-R0 is an efficient thermal cooling product used to heat sink a wide variety of electrical components. It is designed to provide an efficient and reliable method for transferring heat out of an electrical component into a heatsink. The ATS-18H-203-C2-R0 features a thermally conductive, thermally efficient heat sink that is effective at dissipating heat away from the component and out into the atmosphere. The product features an adjustable base, allowing the product to be installed in a variety of enclosures.
The ATS-18H-203-C2-R0 is designed to transfer heat away from an electrical component to a heat sink, which is an enclosure designed to dissipate thermal energy. Heat is transferred from the component through conduction via the base of the heat sink, and is dissipated by either natural or forced convection, or a combination of both. Forced convection is enabled by either fans or blowers, depending upon the application requirements. Natural convection requires no external power, and uses the atmosphere to carry and dissipate the thermal energy.
The ATS-18H-203-C2-R0 is ideal for thermal dissipation of electrical components where there are limited space, weight, and height constraints. The ATS-18H-203-C2-R0 features a lightweight design with a low profile, making it ideal for applications where there is a need for a slim product. The product also features an adjustable mounting base, which allows the product to be installed onto any existing enclosure or platform.
The ATS-18H-203-C2-R0 is capable of dissipating heat from a variety of electrical components. These include processors, FPGAs, and ASICs, as well as power circuits and amplifiers. The product is designed to function with components that are operating at temperatures ranging from +80°C to -55°C. It is also possible to customize the ATS-18H-203-C2-R0 to meet specific application requirements.
The ATS-18H-203-C2-R0 is an ideal thermal solution for both commercial and industrial applications. It is capable of dissipating heat from a wide range of components, and is designed to be easily installed into any enclosure or platform. The product\'s lightweight and low profile design makes it well suited for applications where there are limited space, weight, and height constraints. With its adjustable mounting base, the ATS-18H-203-C2-R0 is a reliable and efficient heat sink solution for many applications.
The specific data is subject to PDF, and the above content is for reference