| Allicdata Part #: | ATS-18H-21-C3-R0-ND |
| Manufacturer Part#: |
ATS-18H-21-C3-R0 |
| Price: | $ 5.05 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-21-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.54545 |
| 30 +: | $ 4.29324 |
| 50 +: | $ 4.04069 |
| 100 +: | $ 3.78813 |
| 250 +: | $ 3.53559 |
| 500 +: | $ 3.28304 |
| 1000 +: | $ 3.21991 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are a type of cooling device used to dissipate heat generated by electronic components in a variety of applications. The ATS-18H-21-C3-R0 is a heatsink that is designed to efficiently move heat away from sensitive components, to help prevent them from burning out or malfunctioning.
Its unique design consists of a 4-layer aluminum-alloyed construction and is delivered with a large fin count. This helps create a high surface area which increases the thermal performance of the heatsink. The ATS-18H-21-C3-R0 is also designed to be of a slim-profile design, so it can fit into tight spaces where traditional heatsinks wouldn’t fit. This makes it ideal for use in applications where space is at a premium.
Due to its slim-profile design, the ATS-18H-21-C3-R0 heatsink can be placed in spaces where the traditional heatsinks may not be able to reach. It is also able to fit in areas with limited floor space, making it a great option for applications that require more efficient cooling solutions. This product can also be used in a range of other applications to help improve performance and reduce cost.
The ATS-18H-21-C3-R0 offers high performance cooling specifically designed for components such as transistors, power amplifiers, and microprocessors. It has a wide range of applications due to its high thermal conductivity and ability to quickly dissipate heat. Its slim-profile allows it to fit in tight spaces that many other heatsinks cannot, making it a great option for applications where space is at a premium.
The ATS-18H-21-C3-R0 is designed to be a highly efficient cooling solution. It utilizes a unique fin process to create an increased surface area, which improves the thermal performance and helps dissipate heat away from sensitive components. The heatsink also uses a four-layer aluminum-alloyed construction to help create a high thermal transfer rate.
The heatsink also has a wide operating temperature range that ranges from -40°C to +85°C, making it suitable for a range of applications. Its tight fit design also enables it to work in densely populated areas, as well as allowing it to fit in tight spaces. This makes it perfect for use in a range of industries, including automotive, telecommunications, and consumer electronics.
The ATS-18H-21-C3-R0 is a highly efficient cooling solution that provides an optimal thermal performance. Its slim-profile design allows it to fit into tight spaces where many other cooling solutions would not, while still providing an efficient cooling process. Additionally, its four-layer aluminum-alloyed construction makes it an extremely durable and long-lasting product. This makes it the perfect choice for applications where an efficient cooling solution is needed.
The specific data is subject to PDF, and the above content is for reference