| Allicdata Part #: | ATS-18H-54-C3-R0-ND |
| Manufacturer Part#: |
ATS-18H-54-C3-R0 |
| Price: | $ 4.07 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-54-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.68991 |
| 30 +: | $ 3.48474 |
| 50 +: | $ 3.27978 |
| 100 +: | $ 3.07484 |
| 250 +: | $ 2.86985 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.61362 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-18H-54-C3-R0 is a specific type of thermal-heat sink that is most commonly used in electronic systems. A thermal-heat sink is a device used to help dissipate heat from electronic components. This type of heat sink is a highly effective solution for cooling electronics, allowing for increased power efficiency by allowing heat to escape the system.
The ATS-18H-54-C3-R0 is typically used in higher power applications, such as high-end CPUs, GPUs, and servers. Because of its size and weight, it is better suited to large-scale, industrial-grade applications such as these. The design of the ATS-18H-54-C3-R0 has a very large surface area, which helps with efficient dissipation of heat. It is also extremely lightweight and has a low profile, allowing for easy integration into any larger application.
The ATS-18H-54-C3-R0 works by transferring heat away from the component it is attached to. Heat is transferred to the fins of the heat sink, which are designed to have a large surface area for increased heat absorption. As the heat is dissipated from the fins, it is released into the air around the component, helping to keep it cool. This process of heat transfer is made possible by the use of thermoelectric elements, which help to create a thermal gradient between the component and the heat sink.
An important factor in the effectiveness of a thermal-heat sink such as the ATS-18H-54-C3-R0 is the air flow around the component. Proper air flow is essential for the efficient transfer of heat away from the component, so it is important to ensure proper air flow when using a heat sink. This means installing the sink in a well-ventilated area and using fans to increase air flow if necessary.
The ATS-18H-54-C3-R0 is typically constructed from aluminum, but other materials such as copper and copper alloys can be used for improved performance. Aluminum heat sinks are typically more affordable, making them an attractive option for smaller, consumer applications, such as personal computers and gaming consoles. Copper and copper alloys are generally much more expensive, but are better suited to larger applications like server farms or industrial applications. Whichever material is chosen, the ATS-18H-54-C3-R0 can provide effective cooling for any application.
The ATS-18H-54-C3-R0 is a highly cost-effective and efficient solution for cooling electronics. Its large fins, lightweight design, and thermoelectric elements make it a great choice for any application. With proper air flow, it can effectively dissipate the heat produced by electronic components, allowing for increased performance and longevity. It is a reliable and versatile solution for cooling any electronic system.
The specific data is subject to PDF, and the above content is for reference