
Allicdata Part #: | ATS31120-ND |
Manufacturer Part#: |
ATS-18H-67-C2-R0 |
Price: | $ 4.33 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X10MM L-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.93750 |
10 +: | $ 3.82851 |
25 +: | $ 3.61595 |
50 +: | $ 3.40326 |
100 +: | $ 3.19051 |
250 +: | $ 2.97781 |
500 +: | $ 2.76511 |
1000 +: | $ 2.71193 |
Specifications
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-18H-67-C2-R0 has been widely used in electronics engineering as a thermal-heat sink. As its name implies, this product dissipates heat from the surface of a device with high efficiency, using its high rate of thermal transfer from its surface area to ambient air. In other words, it functions as an effective heat sink, cooling off hot parts of electronics.The ATS-18H-67-C2-R0 features 18 fins, measuring 6.5mm high, tailored for better performance by increasing surface area. Its heatsink design is well suited for specific applications in electronics, as hardware components such as processors and memory require cooling solutions. In addition to its high rate of thermal transfer, this product’s design helps to maintain a consistent temperature on all of its fins for optimum efficiency.In terms of the ATS-18H-67-C2-R0’s working principle, the idea behind its excellent cooling performance is related to the exchange of air molecules between the surface of the device and ambient air. This process is known as convection, which is when air molecules move from a hot region to a cold region, in order to reach a homogeneous temperature. With this product, a continuous flow of air molecules is created as wind passes over the surface of the heatsink, allowing its fins to transfer heat away from the device. The ATS-18H-67-C2-R0’s application field is highly flexible, as it is designed to fit a variety of hardware such as CPUs, GPUs, FPGAs, memory modules and other electronics. It is also usable in various industrial environments since its lightweight design makes it easy to install in tight spaces such as server rooms and data centers.In conclusion, the ATS-18H-67-C2-R0 is an excellent choice for thermal-heat sink applications due to its superior cooling performance. It features 18 fins which measure 6.5mm high, as well as its excellent exchange rate of air molecules with the surrounding environment. It has a highly flexible application field, as it is suitable for various hardware and industrial environments. Its lightweight and easy-to-install design make it the perfect thermal solution in today’s digital age.
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