| Allicdata Part #: | ATS31122-ND |
| Manufacturer Part#: |
ATS-18H-69-C2-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-69-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat management is crucial in order to ensure better device performance, durability and longevity. Heat sinks are essential components in this effort, but their design and application must be properly adapted to the requirements of a given environment and the characteristics of the device or system to be cooled. The ATS-18H-69-C2-R0 is a heat sink specifically designed for high power applications, featuring a ruggedized design for improved cooling performance and extended durability.
The ATS-18H-69-C2-R0 is made from high quality aluminum, providing great thermal conductivity. Its unique “turbulator” fin design not only increases its cooling capacity, but also improves air flow through it while reducing turbulence and noise. Additionally, its body features a u-shaped “clip-on” mounting system that is compatible with select mounting systems, allowing for a straightforward installation process.
The ATS-18H-69-C2-R0’s cooling capabilities are up to 11,000 BTU/h, making it an ideal choice for high-powered applications such as LED lighting, automotive electronics, sensors, or other demanding devices that require effective heat transfer.
The ATS-18H-69-C2-R0 is designed to maximize the thermal efficiency of the device it is installed on. It is capable of dissipating heat up to 4.5C/W, leading to improved reliability and increased longevity of the device. In addition, its flexible design can accommodate a variety of components and styles as well as providing strong contact between the heat sink and device for optimal performance.
The ATS-18H-69-C2-R0 heat sink functions by utilizing thermal conduction to transfer heat from the device to the heat sink body. This improves cooling capabilities and prevents overheating of the device. From the heat sink body, the heat is dissipated to the ambient air via natural convection.
The ATS-18H-69-C2-R0 is an excellent choice for a variety of high-power applications and is designed for easy installation and maintenance. Its rugged aluminum construction and superior heat dissipation capabilities make it an ideal solution for a wide variety of thermal management needs.
The specific data is subject to PDF, and the above content is for reference