| Allicdata Part #: | ATS31136-ND |
| Manufacturer Part#: |
ATS-18H-83-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-83-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal interface material (TIM) is essential for the efficient operation of any system that needs to dissipate an amount of heat, and TIMs are commonly used as part of a heat sink. ATS-18H-83-C2-R0 is designed to be used as a thermal-heat sink and provides a reliable and efficient way to dissipate large amounts of heat.
The ATS-18H-83-C2-R0 is an extruded aluminum thermal-heat sink developed by Active Thermal Solutions. The aluminum fins of the heat sink are arranged in a parallel-fin configuration to form a continuous fin surface that is optimized for maximum surface area and heat transfer. The heat sink is designed to be used with a thermal interface material (TIM) to provide the most efficient thermal performance. The ATS-18H-83-C2-R0 is an effective choice for cooling applications up to 3500 Watts.
The ATS-18H-83-C2-R0 has a fin height of 8.3 mm and a fin space of 10.6 mm. The fin height is the vertical length of the fin which allows for more efficient heat dissipation and improved thermal performance. The fin spacing is the distance between the fins which increases the surface area and provides maximum heat dissipation. The heat sink is available in a variety of sizes and lengths to meet the needs of a wide range of applications, which can be tailored to the specific heat dissipation needs of the system.
When used with a thermal interface material, the ATS-18H-83-C2-R0 provides a thermally efficient and reliable heat sink solution. The efficient thermal conduction of the heat sink combined with the thermally conductive properties of the TIM allows for heat to quickly and efficiently dissipate from the system and into the surrounding environment. By dissipating heat away from the device, the system is able to operate at its optimal temperature and maximum performance.
The ATS-18H-83-C2-R0 can be used in a variety of different applications. Its versatile design allows it to be used in applications such as CPUs, GPUs, memory, power amplifiers, laser diodes, and many other electronic components where heat needs to be effectively dissipated. The versatility of the heat sink also allows it to be used in applications where traditional heat sinks may not be feasible. The ATS-18H-83-C2-R0 heat sink is also designed to be used in enclosed environments, such as an oil-filled system, which makes it an ideal choice for cooling applications in difficult to cool areas.
The ATS-18H-83-C2-R0 is an effective and reliable thermal-heat sink designed to dissipate heat away from electronic components. When used in combination with a thermal interface material, the ATS-18H-83-C2-R0 provides an efficient way to dissipate heat from the system while remaining reliable and compact. Its versatile design also makes it suitable for a variety of different applications and environments, making it a great choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference