| Allicdata Part #: | ATS-19A-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-19A-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19A-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used in many applications where efficient cooling of critical components is desired. The ATS-19A-117-C1-R0 is a heat sink designed for cooling of power components and other circuitry located in high temperatures and extremely harsh environments. It can be used to provide efficient heat transfer to maintain the required level of temperature control and longevity.
The ATS-19A-117-C1-R0 is a pre-drilled, dynamically conforming heat sink that is designed for efficient thermal transfer. It is composed of aluminum and comes in a range of sizes and shapes to fit in different systems. The material used in this heat sink ensures maximum heat dissipation and a low resistance interface with the surface of the component being cooled. The heat sink also offers a high level of mechanical compliance, which reduces potential damages due to component shifting during transport or sudden accelerations.
The effective area of the ATS-19A-117-C1-R0 is determined by the number of fins and the design of its base. The higher the number of fins, the greater the surface area it generates for higher heat transfer. Its base also serves to distribute and dissipate heat. The efficient design of this heat sink allows for minimal air circulation requirements, and its fin structure reduces impediments to airflow and improves ultimate cooling efficiency.
The ATS-19A-117-C1-R0 has several applications in different industries. For example, it is used in embedded systems for cooling of processors or other critical components in automobiles, aircraft, and medical devices. In many cases, the ATS-19A-117-C1-R0 is used for the cooling of components and systems in extreme operating temperatures, such as those in aerospace applications. The heat sink can also be used whenever improved thermal performance is desired, in order to ensure longer life of system components.
The working principle of the ATS-19A-117-C1-R0 is based on the fact that heat dissipates through contact of two different materials. Heat is transferred from the component being cooled to the heat sink through conduction, while convection aids in the transfer of heat away from the fins and towards the cooler surrounding environment. This helps maintain a more stable temperature in the system and can greatly improve its performance and durability.
The ATS-19A-117-C1-R0 is a highly efficient thermal solution for many applications in harsh environments and extreme working temperatures. With its pre-manufactured fins and base, this heat sink can provide an ideal cooling mechanism for many components and systems. It is a reliable and long-lasting product that helps customers achieve the desired levels of performance without compromising on quality or longevity.
The specific data is subject to PDF, and the above content is for reference