| Allicdata Part #: | ATS31192-ND |
| Manufacturer Part#: |
ATS-19A-127-C2-R0 |
| Price: | $ 4.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19A-127-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.12650 |
| 10 +: | $ 4.01373 |
| 25 +: | $ 3.79058 |
| 50 +: | $ 3.56769 |
| 100 +: | $ 3.34473 |
| 250 +: | $ 3.12175 |
| 500 +: | $ 2.89877 |
| 1000 +: | $ 2.84303 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of electronic engineering. Heat sinks are essential components of a thermal management system, and ATS-19A-127-C2-R0 is one product of this type. This device is designed to evacuate heat from electronics components. It helps maintain optimal working temperatures and protect systems from damages due to excessive heat.
The ATS-19A-127-C2-R0 heat sink uses a grid of fins constructed from aluminum to dissipate heat away from components. The major components responsible for this heat transfer are the fins and base plate, both made from aluminum. Heat generated by the electronic component is conducted through the base plate and then transferred into the thin aluminum fins..
The finned surface area facilitates the transfer of heat by increased convective air movement. Heat is transferred to the atmosphere by way of natural convection, which creates a continuous air flow over the fins and allows for thermal equilibrium between the surface of the component and the surrounding air.
This advanced system also includes thermal conductivity pads that increase the heat transfer coefficient and ensure that heat is evenly distributed along the component\'s surface. In addition, its padded base ensures that heat is not concentrated in one area, which makes it more effective for high-powered components.
The ATS-19A-127-C2-R0 heat sink also features a patented internal baffle system, which maintains a constant and uniform air flow that allows the heat sink to dissipate more heat from the component. This system takes advantage of the natural movement of air and helps ensure uniform temperatures throughout the heat sink and electronic component.
The ATS-19A-127-C2-R0 is a high-performance thermal management solution that is suitable for a wide range of applications including computers, telecommunications, automotive and medical equipment. It is especially useful for applications where temperature must be controlled for optimum performance. The device is also durable and provides reliable service. With its excellent thermal management capabilities and versatility, the ATS-19A-127-C2-R0 is an excellent choice for thermal management in all types of applications.
The specific data is subject to PDF, and the above content is for reference