| Allicdata Part #: | ATS-19A-130-C1-R0-ND |
| Manufacturer Part#: |
ATS-19A-130-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19A-130-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.56265 |
| 30 +: | $ 3.36462 |
| 50 +: | $ 3.16676 |
| 100 +: | $ 2.96881 |
| 250 +: | $ 2.77089 |
| 500 +: | $ 2.57297 |
| 1000 +: | $ 2.52349 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an important component in many electronic applications. The ATS-19A-130-C1-R0 is an example of a thermal - heat sink designed specifically for high current applications. This product is designed to keep its component temperatures at an acceptable level through a combination of heat dissipation, air flow and surface area. In this article, we will discuss the application field and working principle of the ATS-19A-130-C1-R0.
The ATS-19A-130-C1-R0 is designed for applications requiring high current such as power converters, motor drives, and inverters. It also has the ability to dissipate heat at high power levels while providing thermal protection and a low thermal impedance. It is also designed to be a low profile and lightweight heat sink which can be easily incorporated into existing electronics designs.
The ATS-19A-130-C1-R0 utilizes the principle of convection to draw heat away from its components. This heat is then transferred into the heat sink fins, where it is dissipated into the surrounding air. A fan is used to help accelerate the air flow, further increasing the heat dissipation rate. The heat sink is also designed with a large surface area, which helps to increase the rate of heat transfer.
The ATS-19A-130-C1-R0 also has a number of features that make it well suited to high current applications. The fins are made from anodized aluminum, which increases their durability and also increases their thermal conductivity. The fins are also designed to minimize turbulence, which further increases the rate of heat transfer. The fan is also designed to be balanced, helping to reduce any vibration or noise.
The ATS-19A-130-C1-R0 is designed to provide reliable operation over a wide range of temperatures and power levels. It also has a low thermal impedance and excellent heat dissipation capacities, making it ideal for applications requiring high currents and high temperatures. The low profile nature of this product also makes it well suited for electronics designs needing a heat sink with minimal space requirements.
The ATS-19A-130-C1-R0 is an ideal choice for high current applications that require reliable thermal management. Its combination of convection, air flow, and its large surface area make it well suited for high current scenarios, while its low profile and lightweight design make it easy to incorporate into existing electronics designs. With its low thermal impedance and excellent heat dissipation capacities, the ATS-19A-130-C1-R0 is the perfect thermal – heat sink for many applications.
The specific data is subject to PDF, and the above content is for reference