| Allicdata Part #: | ATS-19A-133-C1-R0-ND |
| Manufacturer Part#: |
ATS-19A-133-C1-R0 |
| Price: | $ 5.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19A-133-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.65003 |
| 30 +: | $ 4.39152 |
| 50 +: | $ 4.13318 |
| 100 +: | $ 3.87488 |
| 250 +: | $ 3.61655 |
| 500 +: | $ 3.35823 |
| 1000 +: | $ 3.29365 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.41°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-grade heat sinks play a very important role in various industrial and consumer applications. The ATS-19A-133-C1-R0 is one such product that boasts superior performance. It can be used for chilled liquid storage, thermal control of high-temperature electrical components, and thermal management of high-power applications.
The ATS-19A-133-C1-R0 is a brazed aluminum fin heat sink. It is constructed of a thick aluminum base plate and multiple extruded aluminum fin rows. The heat sink has an ambient temperature of 400°F/204°C and a maximum operating temperature of 700°F/371°C. It offers a higher thermal performance than the standard ATS-19A-133-C1 heat sink.
The ATS-19A-133-C1-R0 heat sink’s working principle is simple. Heat energy produced by an electrical component is dissipated from the component to its environment. This is done by transferring the heat energy from the component to the heat sink. In the heat sink, the heat energy is dissipated to the atmosphere by thermal radiation and convection.
The ATS-19A-133-C1-R0 can be found in many different applications, such as semiconductor packages that require excellent thermal management, high-power transistor amplifiers, and solar cell applications. Its excellent thermal conductivity makes it ideal for these types of applications.
The ATS-19A-133-C1-R0 also offers several design considerations for optimal operation. It features a fairly low profile, which means it can be used in tight spaces without compromising performance. It also has a large array of optional mounting styles, including clips, screws, and studs. Additionally, the heat sink is designed with integral stabilizing fins that provide better and more consistent thermal performance.
The ATS-19A-133-C1-R0 is a high-performance, cost-efficient thermal solution. Its superior thermal design, coupled with the wide array of mounting options, makes it the ideal choice for applications that require reliable thermal management. Its superior performance and excellent design make it an excellent choice for any application requiring a reliable and cost-effective thermal solution.
The specific data is subject to PDF, and the above content is for reference