| Allicdata Part #: | ATS31209-ND |
| Manufacturer Part#: |
ATS-19A-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19A-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are an integral part of modern manufacturing and electronics. When clogged, overheated components can generate a lot of heat, which can damage sensitive equipment. ATS-19A-142-C2-R0 is a thermal - heat sinks that provide thermal cooling solutions for a wide variety of applications.
ATS-19A-142-C2-R0 is an advanced thermal-heat-transfer system designed to transfer and dissipate heat away from a component or assembly. The system consists of a base plate, a finned heat-sinking devise and a cover plate. The heat-sinking device is designed with advanced heat-dissipation technology to transfer the heat away from the assembly and into the atmosphere. The base plate of the ATS-19A-142-C2-R0 is typically attached to the equipment and the heat-sinking device is fastened to the base plate. The cover plate is then placed over the heat-sinking device.
The ATS-19A-142-C2-R0 thermal-heat-transfer system works by the following principles. First, the base plate and the heat-fins capture the heat generated by the device and transfer it to the atmosphere. A fan is typically used to increase the rate of heat transfer away from the assembly and into the atmosphere. As the heat is transferred, the heat-sink cools down, thus reducing the temperature of the device.
The ATS-19A-142-C2-R0 thermal-heat-transfer system is typically used to cool components such as processors, GPUs, and memory chips. This type of heat-sinks is also used in medical applications such as medical imaging equipment and lasers, as well as industrial and electronic applications. The ATS-19A-142-C2-R0 thermal-heat-transfer system is also used in applications where cooler temperatures help protect sensitive components.
The ATS-19A-142-C2-R0 thermal-heat-transfer system is an effective and efficient way to dissipate heat away from components, thus helping to extend their life and improve their performance. It is a cost-effective way to remove heat from components and assemblies, which helps to improve productivity and reduce downtime. The ATS-19A-142-C2-R0 thermal-heat-transfer system is an effective and reliable thermal management solution for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference