| Allicdata Part #: | ATS31240-ND |
| Manufacturer Part#: |
ATS-19A-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19A-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of electronics. Heat sinks are often employed to reduce the operating temperature of components and systems. ATS-19A-170-C2-R0 is a heat sink that is designed to offer excellent thermal performance in a variety of applications. This article will discuss the application field and working principle of ATS-19A-170-C2-R0.
ATS-19A-170-C2-R0 is a heat sink designed for use in high performance electronic applications like server racks, computers, and other electronics where heat dissipation is an issue. This heat sink is designed using a unique aluminum alloy material which is light yet very strong. It has a cylindrical shape and a fin array which enhances the heat dissipation capability. This heat sink is also designed with internal and external thermal conductive layers, which increases its thermal performance.
The ATS-19A-170-C2-R0 heat sink is suitable for use in a variety of applications where improved heat dissipation is required. It is ideal for use in thin server racks and computers where the heat can be quickly dissipated due to close proximity of the components. This type of heat sink is also suitable for use in electronics such as power supplies, hard drives, and any other electronics that produce a lot of heat.
The working principle of ATS-19A-170-C2-R0 is based on conduction. Heat is transferred from the components by means of thermal conduction. The aluminum alloys used in the construction of the heat sink have excellent thermal conductivity properties. The fins on the heat sink also aid in transferring the heat away from the components via air convection. When the thermal load is high, the fins turn red due to the increased heat. However, due to the excellent thermal conductivity of the aluminum alloy, the heat is still efficiently transferred away from the components.
Overall, the ATS-19A-170-C2-R0 heat sink is an excellent choice for heat dissipation in a variety of electronics applications. Its cylindrical shape, fin array, and internal and external thermal conductive layers ensure excellent thermal performance. Its aluminum alloy construction gives it excellent thermal conductivity, allowing it to efficiently transfer heat away from components even at high thermal loads. This makes the ATS-19A-170-C2-R0 an excellent choice for a wide range of heat dissipation applications in electronics.
The specific data is subject to PDF, and the above content is for reference