ATS-19A-176-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.56°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-heat sinks have been used for decades to transfer and dissipate heat from sensitive components and electronics. The ATS-19A-176-C1-R0 is a heat sink designed for use in medium to high power applications. This article will discuss the application field and working principle of the ATS-19A-176-C1-R0.

Application Field

The ATS-19A-176-C1-R0 is designed to be used in applications involving medium to high power dissipation. This includes applications such as power supply and power management, laser diode, LED, and battery-powered electronics.The ATS-19A-176-C1-R0 is designed to dissipate heat away from sensitive components and electronics to prevent them from overheating. It is also designed to protect the components from damage due to the buildup of heat.

Design and Construction

The ATS-19A-176-C1-R0 is designed to be as compact as possible while providing the maximum thermal performance. It has a clip-on design with a clip-on mounting pad on the bottom of the sink that allows it to easily mount to EMI shielded enclosures. It also has four mounting holes which allow it to be easily integrated into existing systems.The ATS-19A-176-C1-R0 is constructed from aluminum and is designed to withstand temperatures up to 140°C. It has two channels on top and bottom to increase surface area which provides more efficient heat dissipation. The metal fins act much like a radiator for efficient dissipating of the heat.

Working Principle

The ATS-19A-176-C1-R0 works by transferring heat away from components and electronics and dissipating it from the surface of the sink. The heat is transferred through the metal fins to the surrounding air. This allows the sink to dissipate heat much more quickly and efficiently than other solutions.The ATS-19A-176-C1-R0 also uses a high-temperature resistant dielectric material, which allows the sink to withstand temperatures up to 140°C while still providing excellent thermal performance. This dielectric material is also designed to withstand corrosion, oxidation, and other environmental factors that can reduce the life of the sink.

Conclusion

The ATS-19A-176-C1-R0 is a thermal-heat sink designed for use in medium to high power applications. It is designed to be as compact as possible while providing the maximum thermal performance. It is constructed from aluminum and uses a dielectric material which allows it to withstand temperatures up to 140°C. The ATS-19A-176-C1-R0 works by transferring heat away from components and electronics and dissipating it from the surface of the sink. This allows it to dissipate heat much more quickly and efficiently than other solutions.

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