ATS-19A-178-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal – Heat Sinks are designed to help dissipate heat that is generated from electronic components. This is important for preventing components from overheating, and helping to ensure that they last a long time. The ATS-19A-178-C2-R0 is a thermal-heat sink module that is designed for a wide variety of applications. In this article we will discuss the applications of the ATS-19A-178-C2-R0, as well as the operating principles that underlie its performance.

ATS-19A-178-C2-R0 Application Fields

The ATS-19A-178-C2-R0 is a thermal-heat sink that is designed for a wide range of applications. It is commonly used in high-powered consumer electronics such as computers, laptops, and gaming consoles. It is also used in industrial applications such as telecommunications, medical, and automotive. This is because the ATS 19A-178-C2-R0 is designed to effectively handle high levels of heat and power, ensuring that the components continue to operate smoothly.

ATS-19A-178-C2-R0 Working Principle

The ATS-19A-178-C2-R0 is designed to dissipate heat more efficiently than conventional heat spreaders. This is because the ATS-19A-178-C2-R0 has an innovative design combining a frame and fin thermally conductive columns that enable the unit to effectively dissipate heat. The thermally conductive columns are arranged in a particular geometry that is designed to maximize the heat dissipation potential of the unit. The columns are also designed to be low-noise and thermally efficient, allowing for a quiet and efficient operation.The frame of the ATS-19A-178-C2-R0 is designed to provide additional structural support for the thermally conductive columns. This stability ensures that the thermally conductive columns remain in place, and effectively aid in heat dissipation. The frame also ensures the structural integrity of the thermally conductive columns, further increasing the efficiency of the device\'s heat dissipation capabilities.

Conclusion

In conclusion, the ATS-19A-178-C2-R0 is a thermal-heat sink module that is designed for a wide variety of applications. The ATS-19A-178-C2-R0 has an innovative design incorporating thermally conductive columns that are designed to maximize the heat dissipation potential of the device. The frame of the ATS-19A-178-C2-R0 is designed to provide additional structural support for the thermally conductive columns, ensuring that the device maintains its maximum efficiency for heat dissipation.

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