| Allicdata Part #: | ATS-19A-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-19A-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19A-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in the design of consumer products. Heat sinks are widely used in electronics products for cooling purpose. They can be classified into three types: active, passive, and reusable thermal heat sinks. ATS-19A-20-C3-R0 is a class of reusable thermal heat sink.
The ATS-19A-20-C3-R0 thermal heat sink includes a cylindrical exterior with stepped convex and concave structures. The upper part of the heat sink is made up of one or more component heat dissipation fins and the lower part of the heat sink is attached to the printed circuit board (PCB). The middle part of the heat sink contains heat pipes for rapid heat transfer.
The ATS-19A-20-C3-R0 thermal heat sink offers an efficient and reliable solution for thermal management. It is suitable for applications where power dissipation is high, and the environment needs low noise and low fan speed. It can be used as an efficient heat sink in central processing units (CPUs), graphics processing units (GPUs), and application processors. It can also be used in computer motherboards, power supplies, and other high-power circuits.
The working principle of the ATS-19A-20-C3-R0 thermal heat sink is based on two physical phenomena, namely, conduction and convection. Heat is conducted through the heat pipes and dissipated through the components’ fins. The convection process involves the air in the environment to absorb the heat. The air flow created by the fan helps to circulate the hot air out of the heat sink. The fan also helps to dissipate the heat more quickly and provide an efficient cooling effect.
The ATS-19A-20-C3-R0 thermal heat sink has some advantages compared to other types of heat sinks. Firstly, it is lightweight and compact, making it easy to mount and install into any device. Secondly, its material is highly durable and resistant to wear and tear. Thirdly, it has a low acoustic signature which makes it suitable for applications with high noise requirements. Furthermore, due to its temperature regulation capabilities, it is suitable for applications where temperatures need to be precisely controlled. Lastly, it can be used in a wide temperature range, from 0℃ to 100℃.
In conclusion, the ATS-19A-20-C3-R0 thermal heat sink is a reliable and efficient thermal management solution suitable for high-power devices. It is lightweight, durable, and has a low noise profile for applications with strict noise requirements. Its superior temperature regulation allows it to be used in a wide temperature range. With its fast heat dissipation capabilities and low fan speed, this type of heat sink is ideal for thermal management in modern electronics.
The specific data is subject to PDF, and the above content is for reference