ATS-19A-30-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19A-30-C1-R0-ND

Manufacturer Part#:

ATS-19A-30-C1-R0

Price: $ 7.36
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19A-30-C1-R0 datasheetATS-19A-30-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.62760
30 +: $ 6.25947
50 +: $ 5.89138
100 +: $ 5.52315
250 +: $ 5.15494
500 +: $ 4.78673
1000 +: $ 4.69468
Stock 1000Can Ship Immediately
$ 7.36
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important aspect of any electronic or electrical system. Heat sources must be kept at acceptable levels in order to ensure reliable operation. Heat sinks are widely used to dissipate heat away from critical device components in order to maintain safe and stable operation. The ATS-19A-30-C1-R0 thermal-heat sink is one such product that delivers effective cooling performance for a wide range of applications.

The ATS-19A-30-C1-R0 is a rugged lightweight aluminum heat sink suitable for use in environments that require special handling (damp, corrosive, high-humidity). It features a variety of features to ensure reliable operation in demanding conditions, including a versatile mounting system, a wide range of solid-state electronic components, and a large fin area to maximize surface area for heat absorption. The heat spreader is designed to spread and dissipate heat more evenly throughout the fin area, helping to eliminate hotspots and ensure uniformity of temperature.

The product is most commonly used in applications that require reliable cooling performance over wide temperature ranges. Such uses include junction-box cooling in telecommunications, industrial, medical, and military applications; component cooling in high power systems; and power semiconductor cooling in high-current rectifiers, motorized electronic devices, solenoids, and motor starters. The ATS-19A-30-C1-R0 is also often used as a heat spreader in thermally-controlled enclosures such as data centers, servers, and storage systems.

The operating principle of the ATS-19A-30-C1-R0 is relatively simple. The aluminum heat sink absorbs heat from the source material and disperses it into the air through its up-wing design. The fins of the heat sink allow for maximum heat dissipation through natural convection, while its steel mounting system ensures that the thermal solution remains securely fastened to the material it is cooling. Additionally, this heat sink utilizes a proprietary ceramic layer in order to reduce thermal resistance, ensuring efficient thermal conductivity. By utilizing a combination of convection and ceramic layer technology, this product is able to regulate temperature with minimal power consumption, making it an ideal choice for energy-conscious systems.

The ATS-19A-30-C1-R0 is a popular thermal-heat sink designed to provide reliable cooling for a wide range of applications. Its lightweight aluminum construction and up-wing design allow for maximum heat dissipation, while the steel mounting system ensures that the heat sink remains securely fastened to the material it is cooling. Additionally, the use of a proprietary ceramic layerhelps to reduce thermal resistance, ensuring more efficient thermal conductivity. These features, combined with its rugged design, make the ATS-19A-30-C1-R0 an ideal choice for systems requiring maximum cooling performance in challenging environments.

The specific data is subject to PDF, and the above content is for reference

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