ATS-19A-32-C3-R0

Thermal management has become increasingly important in the design of everyday electronic components. Heat sinks, in particular, are essential to extend the life of electrical components exposed to high temperatures. As technology has increased the thermal demands of components, higher thermal specifications require more efficient and reliable heat sinks, such as the ATS-19A-32-C3-R0. This efficient thermal solution comes in a compact design and offers enhanced features that make it a great choice for a variety of applications.

Application Field

The ATS-19A-32-C3-R0 is designed with precision and efficiency in mind. It features a modular construction with an array of different sized fins and heat pipes to create an efficient flow of cooling air. This makes it an ideal choice for enclosures that require tight spaces for thermal management. It’s also perfect for applications where a highly efficient thermal solution is required within a limited air flow. Additionally, the ATS-19A-32-C3-R0 is great for applications where the performance-to-weight ratio is important, such as industrial, medical, automotive and military.

Construction and Specifications

The ATS-19A-32-C3-R0 is constructed using high-grade aluminum and copper with a special coat to ensure long-term corrosion protection. The top and bottom plates are constructed from machined copper for maximum durability and heat transfer efficiency. The top and bottom plates also feature a chamfered edge that helps reduce air turbulence when air is forced through the heat sink. Additionally, the fins are constructed from a proprietary aluminum alloy to ensure excellent performance.

The ATS-19A-32-C3-R0 has a nominal size of 19”x32”x3” and a nominal resistance of 0.05°C/W. It can operate at up to 150°C and its fanless design offers a maximum noise level of 25 dBa. Additionally, the heat sink’s thermal conductivity and low air flow resistance contribute to its excellent cooling performance.

Working Principle

To ensure efficient heat dissipation, the ATS-19A-32-C3-R0 utilizes a combined approach to thermal management. This approach involves the use of multiple heat pipes that are embedded in the top and bottom plates of the heat sink. The heat pipes draw heat away from the component and distribute it evenly throughout the fin array, providing efficient and uniform cooling. At the same time, a fanless design helps keep the noise level low while still providing excellent cooling performance.

Overall, the ATS-19A-32-C3-R0 is an excellent choice for thermal management needs. With its compact design and superior thermal performance, it allows for a wide range of applications in a wide range of industries. Its fanless design also provides a quiet and reliable operation for many applications.