| Allicdata Part #: | ATS-19A-35-C3-R0-ND |
| Manufacturer Part#: |
ATS-19A-35-C3-R0 |
| Price: | $ 5.53 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X5.84MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19A-35-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.97385 |
| 30 +: | $ 4.69749 |
| 50 +: | $ 4.42109 |
| 100 +: | $ 4.14477 |
| 250 +: | $ 3.86845 |
| 500 +: | $ 3.59213 |
| 1000 +: | $ 3.52306 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important for many electronic applications. Heat sinks are an important component of these systems. ATS-19A-35-C3-R0 is a thermal - heat sink solution designed for superior cooling performance in applications that require a small footprint. This heat sink features a combination of low-profile design and high-efficiency fin construction that provide an ideal solution for today’s smaller electronic systems.
The ATS-19A-35-C3-R0 thermal- heat sink is designed for low profile applications with high power density demands. This heat sink utilizes a combination of specially designed fins and channels to maximize cooling efficiency. This low-profile design ensures the heat sink is small and lightweight, making it ideal for a wide range of applications. The high-efficiency fin construction also allows the heat sink to quickly transfer heat away from sensitive components. This helps to prevent device failure and ensure the highest levels of reliability.
The ATS-19A-35-C3-R0 thermal- heat sink is designed to maximize cooling efficiency in applications that require a small footprint. This heat sink features a network of channeled cooling fins that promote efficient airflow to more effectively disperse heat. The innovative fin pitch and contour also helps ensure maximal heat dissipation from components. Additionally, the low-profile design reduces the overall size and weight of the heat sink, making it suitable for more space-restricted areas where integration requires minimal footprint.
The ATS-19A-35-C3-R0 thermal- heat sink is designed for applications that require superior cooling performance in limited space. This heat sink features a combination of low-profile design and high-efficiency fin construction that provide an ideal solution for today\'s smaller electronic systems. Additionally, the network of channeled cooling fins helps to dissipate heat away from components to ensure maximum thermal management. As a result, this heat sink is a reliable and efficient solution for a wide range of applications.
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