ATS-19A-73-C1-R0 Fans, Thermal Management |
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| Allicdata Part #: | ATS-19A-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-19A-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19A-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19A-73-C1-R0 is a type of heat sink designed to keep components such as microprocessors cool. A heat sink is a device that acts to transfer or dissipate heat away from the surrounding environment. In the case of the ATS-19A-73-C1-R0, this is done by means of metal pipes or tubes with fins attached to them. The fins provide a large surface area for heat to dissipate by convection, which keeps the component cool without the need for additional cooling fans.
The ATS-19A-73-C1-R0 is specifically designed to be used with small, low power components such as microprocessors. It is slim enough to fit in tight spaces and is constructed from high-quality aluminum for maximum effectiveness. The fins are designed to create a turbulent air flow, which helps to increase the amount of heat dissipated from the component.
The ATS-19A-73-C1-R0 uses a simple yet effective design to be efficient at dissipating heat. It consists of multiple metal tubes with the fins attached directly to the tubes. When the component produces heat, the tubes heat up and create a convection current within the fins. This draws air through the fins to keep the component cool.
The ATS-19A-73-C1-R0 is designed to be used in applications where space is at a premium and cooling is required. It is an effective heat sink for small, low power components, and its slim design allows it to fit into tight spaces. This makes it an ideal solution for applications such as embedded systems or other compact applications. The ATS-19A-73-C1-R0 is a great choice for keeping components cool without taking up a lot of extra space.
The specific data is subject to PDF, and the above content is for reference