ATS-19A-80-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-19A-80-C3-R0-ND

Manufacturer Part#:

ATS-19A-80-C3-R0

Price: $ 3.54
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19A-80-C3-R0 datasheetATS-19A-80-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.22182
30 +: $ 3.13467
50 +: $ 2.96050
100 +: $ 2.78630
250 +: $ 2.61218
500 +: $ 2.52510
1000 +: $ 2.26388
Stock 1000Can Ship Immediately
$ 3.54
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 19.22°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to ATS-19A-80-C3-R0

ATS-19A-80-C3-R0 is a thermal-heat sink which is an integral component of many thermal management systems. It is designed for managing heat generated from electronic components in systems or processes. This device makes use of its thermal-capacitance to remove heat generated by these components. This device is one of the most efficient and widely used thermal-heat sinks for the thermal management of electronic components. It not only provides a high level of reliability and performance during operation, but also prevents the risk of thermal-related failures.

Application Field and Working Principle of ATS-19A-80-C3-R0

ATS-19A-80-C3-R0 is a highly efficient and reliable thermal-heat sink with excellent thermoelectric properties. It is designed for use in any environment where thermal management is needed and optimal performance is required. It is suitable for high-power applications and for cooling temperatures above 85 degrees Celsius. The device can be used in a variety of applications such as medical equipment, automotive, aerospace, military equipment, and consumer applications. It is also widely used in applications involving electronics such as computers, datacenter equipment, and laptop applications. It is also suitable for applications that require high levels of power dissipation.

The device has a simple yet efficient design which makes it a popular choice for many thermal management solutions. It works by trapping heat from the device and dissipating it away from the device. This is done by using a combination of heat conduction, convection, and radiation. Heat is first conducted away from the device into a thermal-mass structure made from a highly conductive material, such as copper or aluminum. This allows for large amounts of heat to rapidly transfer away from the device. Once the heat has been conducted to the thermal-mass structure, it is then transferred to the air or atmosphere via convection. The air or atmosphere is then in turn cooled by radiation.

ATS-19A-80-C3-R0 has a unique design which allows it to trap more heat than other thermal-heat sinks, making it highly efficient at heat dissipation. It is also highly reliable due to its simple design and high-quality materials used during production. As mentioned above, this thermal-heat sink is suitable for use in a variety of applications and environments. It is also vastly used in military and aerospace applications due to its high level of efficiency and reliability.

In conclusion, ATS-19A-80-C3-R0 is a highly efficient and reliable thermal-heat sink. It is designed for use in any environment where thermal management is needed and optimal performance is required. Its design makes it ideal for military and aerospace applications, and it is also suitable for consumer, datacenter, and laptop applications. The device works by trapping heat from the device and dissipating it away from the device using a combination of heat conduction, convection, and radiation.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics