| Allicdata Part #: | ATS-19A-91-C3-R0-ND |
| Manufacturer Part#: |
ATS-19A-91-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-19A-91-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-19A-91-C3-R0 application field and working principle
Thermal - Heat Sinks (ATS-19A-91-C3-R0) are an important component of any electronic device. They act as thermal interfaces between the hot and cold surfaces of a device, creating a channel for heat to regulate the temperature. Thermal - Heat Sinks can be used in a variety of applications, such as radio frequency (RF) amplifiers, solid state drives (SSD), and in telecommunications related equipment. These are commonly used in consumer electronics, such as laptops, game consoles, and other digital media players.
Thermal - Heat Sinks absorb and dissipate heat away from the device, which allows efficient operation of the device. The process by which this heat transfer occurs is called \'convection\'. This means that the thermal - heat sink works by allowing air to flow around the object which it is attached to. Air flows around the heat sink and takes heat away from the object, allowing the temperature to stay regulated.
To be able to effectively dissipate heat, the thermal - heat sink must come in contact with a cool surface. This is usually the base plate of the device. Cool air can then flow around the base plate to help dissipate the heat away from the device. The air flow must then be uninterrupted and work in conjunction with the thermal - heat sink in order to maximize its benefits.
To optimize the efficiency of the thermal - heat sink, the fan and fan frame must also be optimized. The air flow around the fan frame should be optimized to minimize turbulence. Additionally, the fan and fan frame should be designed so that it allows air to move easily through the heat sink and the surrounding environment. This helps reduce the air-resistance and creates a higher rate of air circulation around the sink. This helps to cool the device even faster.
The thermal - heat sink also should be installed in a manner so that it is not too close to a wall. This is because the air flow around the heat sink should be able to circulate freely. If this is not possible, the thermal - heat sink should be positioned far enough away from walls to ensure that it is not blocking any ventilation grills.
The thermal - heat sink has many other advantages over other cooling methods, such as liquid cooling, which are more expensive and less efficient. Thermal - Heat Sinks are lighter, simpler, less noisy, and energy-efficient compared to other cooling methods. This makes them an ideal choice for many electronic devices.
The thermal - heat sink is an effective and reliable way to cool down electronic devices. It is a cost-effective solution, which can help to reduce operational costs and also improve the performance of electronic devices. As such, Thermal - Heat Sinks (ATS-19A-91-C3-R0) are essential components in any electronic device.
The specific data is subject to PDF, and the above content is for reference
ATS-19A-91-C3-R0 Datasheet/PDF