| Allicdata Part #: | ATS-19B-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-19B-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-19B-02-C3-R0 is a thermal heat sink that is used to quickly and efficiently dissipate heat from an electronic device. Its application fields are mainly related to high-density or high-power circuits such as power electronic components, switching circuits, high-end computers, military hardware, communication systems, automobiles, robotics and other electronic devices.
This heat sink is made from anodized aluminum alloy which provides superior thermal resistance. Its design features a flared base with an integral fin array that provides maximum surface area for efficient heat transfer. This design also helps to minimize air gaps which can contribute to hotter temperatures. In addition, the fins are formed with sharp edges that increase air flow turbulences resulting to more efficient cooling. Its superior anodized coating offers better oxidation and abrasion resistance compared to regular heat sinks.
The working principle of this thermal heat sink is simple. Heat from the device is engrossed by the base, then dissipates through the fins to the ambient air. As the fins are designed to have maximum surface area, the heat will be dissipated more quickly and effectively.
An advantage of this thermal heat sink is that it is relatively easy to install and maintain. Its standard mounting holes allow it to be installed to a wide range of mounting materials. And its integral fin design also helps to reduce contamination since the fins can’t easily separate from the base. For maintenance, the fins can be easily cleaned using a soft brush or a vacuum cleaner.
All in all, ATS-19B-02-C3-R0 is a high quality thermal heat sink that can dissipate heat quickly and efficiently. Its favorable features such as superior thermal resistance, maximum surface area and easy installation make it ideal for various electronic applications.
The specific data is subject to PDF, and the above content is for reference