| Allicdata Part #: | ATS31354-ND |
| Manufacturer Part#: |
ATS-19B-04-C2-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-04-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.50280 |
| 10 +: | $ 3.41208 |
| 25 +: | $ 3.31960 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are used in many different applications, but one of the most commonly used is the ATS-19B-04-C2-R0. This type of heat sink is used to dissipate heat from electrical components with high heat output, such as CPUs and GPUs, while helping to maintain component temperatures within required operating levels. In this article, we\'ll discuss the application field and working principle of the ATS-19B-04-C2-R0 heat sink.
The ATS-19B-04-C2-R0 is designed to dissipate heat from high-power components, such as CPUs and GPUs. These components generate a lot of heat when operating at full capacity, and the thermally conductive metal used in the heat sink helps to quickly disperse the heat away from the component. The heat sink is designed with fins that have a large thermal surface area that helps to increase the amount of heat that can be dissipated.
This heat sink is designed to work with a variety of power supplies, including AC and DC power sources. The design includes dissipaters that can channel heat away from the component and into the ambient air. The fins of the heat sink are able to dissipate heat more effectively than other designs, as they are angled and spaced out properly. This ensures that the component will not overheat when it is operating for extended periods.
The ATS-19B-04-C2-R0 heat sink is designed with robust structural components, including stainless steel plates, thermally conductive metal and a thermally conductive adhesive. This ensures that the heat sink remains structurally sound even when it is in use. The construction of this type of heat sink also ensures that it can be mounted in a variety of different orientations, allowing it to be used in a variety of applications.
The working principle of the ATS-19B-04-C2-R0 is fairly simple. The heat sink works by dissipating heat from the component to the fins of the heat sink. This is accomplished through the conduction of heat from the component to the fins of the heat sink. The heat is then dispersed into the ambient air, which helps to keep the component from overheating.
Since the ATS-19B-04-C2-R0 heat sink is designed with thermally conductive materials, it is able to dissipate more heat than other heat sinks on the market. This makes it an ideal choice for use with high-power components, such as CPUs and GPUs, as it can quickly and effectively remove heat from the component. The ATS-19B-04-C2-R0 heat sink is also easy to install, as it can be mounted in a variety of positions and orientations.
The ATS-19B-04-C2-R0 is an excellent choice for use in many different applications. It is designed to effectively dissipate heat from high-power components, while also being highly durable and easy to install. This heat sink is a great choice for any application where high heat output components need to be properly cooled.
The specific data is subject to PDF, and the above content is for reference