| Allicdata Part #: | ATS-19B-11-C3-R0-ND |
| Manufacturer Part#: |
ATS-19B-11-C3-R0 |
| Price: | $ 3.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-11-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.48138 |
| 30 +: | $ 3.28818 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a key component in many electronic systems. Heat sinks are an important device to help dissipate or reduce heat generated by these systems, and the ATS-19B-11-C3-R0 by Advanced Thermal Solutions is an excellent choice for a variety of heat sink applications. In this article, we’ll take a look at the ATS-19B-11-C3-R0 application field and working principle.
The ATS-19B-11-C3-R0 thermal heat sink is designed for efficient cooling in a range of applications. It is ideal for situations where natural convection cannot dissipate the heat effectively, such as within a confined space or a high-traffic environment. The ATS-19B-11-C3-R0 is specifically designed to keep temperatures as low as possible by using efficient fan-assisted cooling. This feature makes the device suitable for use in industrial, as well as consumer applications.
The ATS-19B-11-C3-R0 features advanced aluminum fin design. The fin design maximizes surface area and increases air circulation. This makes it possible for the ATS-19B-11-C3-R0 to dissipate heat quickly and efficiently. The fins are also designed with air guides and deflectors that provide extra cooling efficiency by redirecting air as it travels through the heat sink.
The ATS-19B-11-C3-R0 has a thermally conducting backplate made from anodized aluminum. This backplate is designed to spread the heat from the source device, such as a processor or an amplifier, to the fins more evenly. This ensures that the heat will be removed quickly and uniformly.
The ATS-19B-11-C3-R0 also features a PWM controlled, 12V DC fan with ball bearing design for superior reliability and performance. The fan is dynamically controlled to allow for optimal speed and airflow. The fan can also be silenced if needed, allowing for silent operation.
In addition, the ATS-19B-11-C3-R0 includes hardware and mounting accessories. Rails and clips are included to allow for easy attachment and removal of the heat sink, as well as thermal or normal adhesive tape for direct mounting. The ATS-19B-11-C3-R0 also includes a three-pin power connector cable to make installation easy and hassle-free.
The ATS-19B-11-C3-R0 thermal heat sink is an excellent choice for efficient cooling in a range of applications. Its high-performance aluminum fin design, thermally conducting backplate, and dynamically controlled fan make it capable of dissipating heat quickly and efficiently. Its simple design and mounting accessories make it easy to install and maintain. With the ATS-19B-11-C3-R0 thermal heat sink, you can count on reliable and efficient thermal management for your electronic systems.
The specific data is subject to PDF, and the above content is for reference