ATS-19B-110-C2-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.126" (54.01mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.99°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

THERMAL - Heat Sinks are designed to dissipate the thermal energy generated by electronic components and circuits. To maximize the performance and scale down the size and weight of a heating or cooling device, the use of heat sinks has become an increasingly popular choice for many applications. Due to its efficient thermal dissipation properties, the ATS-19B-110-C2-R1 Heat Sink is an ideal solution for the design and construction of a wide range of critical electronic systems.

Application Fields

The ATS-19B-110-C2-R1 is ideally suited for the cooling of PCB assemblies in a variety of applications. This includes computers, telecommunications systems, medical systems, automation equipment, industrial control systems, automotive electronics, and the rapidly growing range of consumer electronics. The heat sink is also an perfect solution for high-end applications such as high power-intensity amplifier systems, high-power servers, and cutting-edge supercomputers due to its particularly efficient thermal dissipation structures.

Working Principle

The ATS-19B-110-C2-R1 operates on the principle of forced convective cooling by utilizing heat fins which are stocked with greased channels for optimal performance. The large surface area of the fins helps to increase the contact area between the air and the unit’s heat sink, thus enabling high thermal energy dissipation. The fins are also made from corrosion-resistant aluminum, enabling them to withstand high temperatures and greatly reduce the effects of thermal cycling.The ATS-19B-110-C2-R1 is designed with an advanced dual fan mechanism that can be activated to maximize the thermal energy dissipation. The fans change speed according to the thermal needs of the application, so that the heat sink can maintain optimal working temperatures. To ensure maximum heat transfer, lamina air curtains have been installed within the channels of the heat sink. This minimizes the air gap between the channel walls and the fins, thus enabling high thermal energy dissipation even when the surrounding environment is much cooler.

Benefits

The ATS-19B-110-C2-R1 provides several benefits that make it an outstanding for many types of thermal equipment. Its efficient thermal dissipation properties can prevent damage to the electronic components and help maintain the device’s stability. In addition, the dual fan mechanism helps to regulate the cooling process so that the temperature of the equipment can be maintained. The large contact area of the fins allows for greater heat conduction, and the corrosion-resistant material ensures durability and reliability.In summary, the ATS-19B-110-C2-R1 Heat Sink is a powerful and reliable tool for tackling the challenge of dissipating thermal energy. With its efficient thermal dissipation properties, durable construction and dual fan cooling system, the ATS-19B-110-C2-R1 Heat Sink can provide reliable protection for a wide range of critical electronic systems.

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