| Allicdata Part #: | ATS-19B-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-19B-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important field for electrical and electronic engineers as it affects the performance, reliability, and safety of any electrical or electronic device. The ATS-19B-117-C1-R0 thermal heat sink is an important tool used in this arena. This heat sink helps to dissipate heat away from electronics components, allowing them to operate reliably and safely over a long period of time. This article will explore the ATS-19B-117-C1-R0 application field and working principle.
The ATS-19B-117-C1-R0 thermal heat sink is used to manage the temperatures of a wide range of electronic components. These include semiconductor devices, power modules, and other high-power components. It is suitable for applications in residential, commercial, and industrial settings. The heat sink is specially designed to dissipate heat faster than air cooling or uncoated heat sinks. It is a highly efficient, cost-effective, and reliable solution for thermal management.
The heat sink works through a convection process. Hot air rises, creating a pressure gradient between the air and the heat sink surface. This causes air to flow over the heat sink’s fins, taking the heat away from the component and dissipating it into the surrounding environment. The fins are designed to maximize the surface area for improved thermal management. The ATS-19B-117-C1-R0 has a fin profile and airfoil shape that ensure efficient and uniform heat removal.
The ATS-19B-117-C1-R0 thermal heat sink also features an oxidation resistant coating. This coating helps to protect the surface of the heat sink from corrosion and oxidation caused by time and temperature fluctuations. It is a reliable and durable heat sink designed for even the harshest environments.
The ATS-19B-117-C1-R0 thermal heat sink can be used in a variety of different applications. These include power modules, IGBT modules, MOSFET modules, rectifiers, resistors, and diodes. It is also suitable for various cooling systems including air, liquid, and natural convection. It can be used in high temperatures and vibration of 0.004g2/Hz.
In summary, the ATS-19B-117-C1-R0 thermal heat sink is a reliable and effective heat management tool. Its efficient fin profile and airfoil shape ensures uniform and efficient heat removal. It has an oxidation-resistant coating which makes it ideal for even the most challenging environments. It is suitable for a wide range of applications and various cooling systems. This makes the ATS-19B-117-C1-R0 thermal heat sink an ideal choice for any thermal management project.
The specific data is subject to PDF, and the above content is for reference