| Allicdata Part #: | ATS-19B-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-19B-12-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-heat sinks are widely used in a variety of industries, from consumer electronics to automotive and aerospace. The ATS-19B-12-C3-R0 Heat Sink is a particularly effective product for dissipating heat from electronic components and protecting their performance in high-temperature contexts. This article will provide an in-depth overview of the ATS-19B-12-C3-R0 application field and working principle.
The overall design of the ATS-19B-12-C3-R0 Heat Sink features two pieces separated by a gap. This gap allows air to move between the two pieces, which helps to dissipate the heat generated by the electronic components. The two pieces are connected by two individual clips which join the bottom of each piece together for added stability. The bottom of the heat sink also features stem clips which are used to attach the heat sink to a variety of surfaces.
The primary application of the ATS-19B-12-C3-R0 Heat Sink is in devices that require efficient heat dissipation, such as in consumer electronics like cell phones, laptops and PCs. The heat sink is also used in applications where a higher level of heat is required, such as automotive and military electronics. In addition, the ATS-19B-12-C3-R0 Heat Sink is also used for cooling high-temperature semiconductor devices. The product is also suitable for various industrial applications such as industrial extrusions, die-casting, LED lighting, and PCBs.
The ATS-19B-12-C3-R0 Heat Sink works on the principle of thermal convection. As heat is generated by the electronic components, hot air rises and is replaced by cooler air from the outside. This process, known as convective air-flow, increases the cooling rate of the electronic components and helps to extend their life. The effectiveness of the ATS-19B-12-C3-R0 Heat Sink can be further increased by using the optional fan accessories, which allow the air-flow to be increased to maximize the efficiency of the heat dissipation.
The ATS-19B-12-C3-R0 Heat Sink is compatible with a variety of electrical components, including TO-220 packages, FETs, rectifiers and transistors. Because of its universal design, the product is suitable for a wide range of applications. It is also easy-to-install and comes with a 12-month warranty.
The ATS-19B-12-C3-R0 Heat Sink is an excellent option for those looking for efficient heat dissipation in their applications. Its lightweight and flexible design make it easy to install, and the optional fan accessories can further increase the cooling rate. The product is also compatible with a variety of electronics, making it suitable for a wide range of applications. In addition, it comes with a 12-month warranty for added peace of mind.
The specific data is subject to PDF, and the above content is for reference