| Allicdata Part #: | ATS31384-ND |
| Manufacturer Part#: |
ATS-19B-121-C2-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-121-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.56580 |
| 10 +: | $ 3.47130 |
| 25 +: | $ 3.37756 |
| 50 +: | $ 3.18982 |
| 100 +: | $ 3.00220 |
| 250 +: | $ 2.81459 |
| 500 +: | $ 2.72077 |
| 1000 +: | $ 2.43931 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19B-121-C2-R0 is an efficient, advanced thermal solution for many applications. It is classified as a Heat Sink, a device that helps dissipate heat through convective heat transfer. The ATS-19B-121-C2-R0 is an efficient thermal management tool designed to help prevent overheating in electronic components and heated equipment.
The unique design of the ATS-19B-121-C2-R0 enables it to be used for many different kinds of applications. It is lightweight and compact, making it highly suitable for a wide range of portable electronic applications. It is effective in environments where there is limited space available for cooling solutions.
The ATS-19B-121-C2-R0 is constructed with a patented thermal design. It utilizes a high-density fin structure, which increases its surface area, allowing it to absorb and quickly dissipate more thermal energy away from the electronic component or heated device. This design also helps to redirect air from the component, further aiding in thermal management.
The working principle behind the ATS-19B-121-C2-R0 is relatively simple. Heat is transferred from the surface of the electronic component or heated device to the finned structure of the ATS-19B-121-C2-R0. This heat is dissipated away from the device by convective heat transfer, which is aided by natural air currents. The ATS-19B-121-C2-R0 has been designed with airflow optimization in mind, ensuring that the air currents flow with the most efficient path.
The ATS-19B-121-C2-R0 is suitable for a variety of commercial and industrial applications. It is ideal for areas where space is limited and thermal management must be considered. This thermal solution is suitable in applications including, but not limited to, power converters, servers, UPS systems, computers, medical equipment, and many more.
In conclusion, the ATS-19B-121-C2-R0 is an ideal choice for many applications where thermal management is important. Its efficient design helps to improve thermal dissipation, allowing electronic components and other devices to operate at optimal temperatures. The ATS-19B-121-C2-R0\'s lightweight and compact design makes it very suitable for many portable applications, as well as a variety of industrial and commercial applications.
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