| Allicdata Part #: | ATS31407-ND |
| Manufacturer Part#: |
ATS-19B-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks can be effectively used to manage the heat of the components and to avoid overheating of the objects. The ATS-19B-142-C2-R0 is one of the most advanced and efficient thermal-heat sinks in the market. This article takes a look at the application field and working principle of this advanced thermal-heat sink.
Application of the ATS-19B-142-C2-R0 Thermal-Heat Sink
The ATS-19B-142-C2-R0 is suitable for use in high power electronics application in the industrial sector. It can be used for applications such as Enhanced Power MOSFETs, Power Rectifiers, High Voltage Converters, DC Motors and High Power Soldering. This thermal-heat sink is also suitable for LED lighting applications. The high temperature and efficient heat dissipation characteristics of this thermal-heat sink make it an ideal choice for these applications. The wide application field of this thermal-heat sink makes it a popular choice among consumers.
Working Principle of the ATS-19B-142-C2-R0 Thermal-Heat Sink
The ATS-19B-142-C2-R0 thermal-heat sink has been designed to absorb and dissipate the heat generated from the electronic components. The efficient heat dissipation is made possible due to the high thermal conductivity of the heat sink material. This thermal-heat sink uses a combination of high conductivity materials and advanced thermal transfer technology. The heat is absorbed by the heat sink and then distributed across its entire surface area. This ensures efficient heat dissipation and the hot spots on the electronic component are avoided. The efficient heat dissipation ensures that the electronic components are running at their optimal temperature and do not suffer from overheating.
Construction of the ATS-19B-142-C2-R0 Thermal-Heat Sink
The ATS-19B-142-C2-R0 thermal-heat sink is constructed from high quality aluminum alloy. This provides strength and rigidity to the thermal-heat sink and ensures a high level of durability. The aluminum alloy construction also provides high thermal conductivity, which ensures efficient heat dissipation. Furthermore, the metal lamination of the heat sink also ensures efficient heat transfer from the electronic components to the heat sink.
The thermal-heat sink is available in different shapes and sizes, depending on the application requirement. The heatsink can be custom designed for each application, which allows for the best possible heat dissipation for the application. Furthermore, the ATS-19B-142-C2-R0 thermal-heat sink can be mounted with the aid of a mounting bracket, which allows for easy installation.
Conclusion
The ATS-19B-142-C2-R0 thermal-heat sink is an efficient and advanced thermal-heat sink for high power electronic applications in the industrial sector. The wide application field and efficient heat dissipation capability of this thermal-heat sink make it an attractive choice for consumers. The high quality construction and custom design of the ATS-19B-142-C2-R0 thermal-heat sink further enhances its performance and features.
The specific data is subject to PDF, and the above content is for reference