| Allicdata Part #: | ATS-19B-168-C1-R0-ND |
| Manufacturer Part#: |
ATS-19B-168-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-168-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-19B-168-C1-R0 Thermal - Heat Sinks: Application Field and Working Principle
The ATS-19B-168-C1-R0 Thermal - Heat Sink is a highly efficient heat transfer device that is designed to keep electrical components and systems at operating temperatures where they are safely and efficiently used. Heat Sinks are used in many areas of industry to provide a reliable cooling source for components that generate heat during operation. They are widely used in the automotive, aerospace, consumer electronics, telecom, medical, industrial automation and control, and transportation industries.
The ATS-19B-168-C1-R0 is a thermally controlled heat sink, designed for improved heat dissipation, and provide thermal performance in environments requiring forced air or natural convection cooling. This device is cost-effective and easy to install with minimal assembly required. It features a highly durable thermally conductive heat sink body, a slotted fin which directs air to the heat sink at a specified speed, and a clip-on base plate that is quickly and easily secured to the PCB.
The ATS-19B-168-C1-R0 Thermal - Heat Sink is designed to efficiently transfer heat away from the PCB. This is accomplished by conducting the heat away from the PCB through the fin and into the ambient air. The heat sink itself utilizes a conduction method in order to transfer heat to the ambient air. The efficient conduction of heat is achieved by optimizing the thermal resistance and bypass of air around the fins and through the base plate.
The fin design of the ATS-19B-168-C1-R0 Thermal - Heat Sink is optimized to maximize air flow and dissipation of heat. This design also ensures that air is evenly distributed across the fins in order to optimize cooling. The slotted fin directs air to the heat sink, providing the optimal dissipation of heat from the heat sink to the surrounding air. The clip-on base plate is provided with an embedded mounting hole in order to securely mount the heat sink to the PCB.
The performance of the ATS-19B-168-C1-R0 Thermal - Heat Sink is highly effective and efficient. The device is designed with a custom thermal interface material that eliminates the need for thermal grease, or extra thermal interface materials, thus saving time and money. Additionally, the performance of the heat sink can be customized with special cooling requirements, such as adding or removing fins, to suit different applications.
The ATS-19B-168-C1-R0 Thermal - Heat Sink is suitable for many applications where PCB and component cooling is required. It is ideal for use in consumer electronics, telecom, medical, industrial automation and control, and transportation industries – where efficient cooling solutions are essential. The device is robust, cost-effective, and easy to install with minimal assembly required.
The specific data is subject to PDF, and the above content is for reference