| Allicdata Part #: | ATS-19B-171-C3-R0-ND |
| Manufacturer Part#: |
ATS-19B-171-C3-R0 |
| Price: | $ 3.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-171-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.38814 |
| 30 +: | $ 3.29658 |
| 50 +: | $ 3.11346 |
| 100 +: | $ 2.93026 |
| 250 +: | $ 2.74713 |
| 500 +: | $ 2.65555 |
| 1000 +: | $ 2.38083 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-19B-171-C3-R0 application field and working principle
Heat sink devices are most commonly used for the cooling of electrical and electronic components, such as CPUs, GPUs, RAM, and other components. Heat sinks are often used in conjunction with cooling fans to make sure that components do not overheat or suffer damage due to excessive heat. The ATS-19B-171-C3-R0 thermal heat sink is a high-end device specifically designed to cool various components in the most effective and efficient way possible.
The ATS-19B-171-C3-R0 features a rectangular-shaped design and is constructed from lightweight aluminum with an anodized finish to ensure it has excellent heat dissipation capability. Its design also features a number of strategically located fins that are designed to act as heat dissipating surfaces.
The ATS-19B-171-C3-R0\'s design is accompanied by an advanced cooling system which features a retention bracket that helps to ensure it remains securely in place upon installation. This helps to maximize the contact between the device and components resulting in better cooling performance. Additionally, the heat sink device also features an integrated fan that is designed to further improve cooling performance.
In terms of its working principle, the ATS-19B-171-C3-R0 makes use of convection to draw air over its fins. As the air passes through the fins, the heat generated by the components is absorbed and then dissipated out of the fins. This process helps to keep the components cool and ensures they don’t suffer from excessive heat damage.
The ATS-19B-171-C3-R0 offers a wide range of applications and can be used with various types of components. It is especially well-suited for the cooling of CPUs, GPUs, RAM, and other components and can be used in office and home computers, servers, and other equipment.
The ATS-19B-171-C3-R0 thermal heat sink is an advanced device that helps ensure system components remain cool and always perform to their highest potential. Its advanced design, along with its integrated fan, allows it to provide maximum cooling performance while taking up minimal space.
The specific data is subject to PDF, and the above content is for reference