| Allicdata Part #: | ATS-19B-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-19B-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat sinks are a type of heat transfer device that is used to absorb, conduct, and dissipate heat away from sensitive components. The ATS-19B-173-C1-R0 is a heat sink manufactured by Advanced Thermal Solutions that has a unique application field and working principle.
The ATS-19B-173-C1-R0 is a versatile heat sink specifically designed for use in a variety of applications such as telecommunications, video, storage, and networking. Its universal design provides excellent heat dissipation characteristics in confined spaces. The ATS-19B-173-C1-R0 is suitable for a variety of thermal management solutions, including air cooling, forced convection cooling, liquid cooling, and active fluid-flow cooling.
The ATS-19B-173-C1-R0 utilizes a shape optimized fin profile for superior heat transfer efficiency and optimal overclocking performance. Additionally, a patented non-porous layer is included in the design of the ATS-19B-173-C1-R0 to improve heat distribution and reduce temperature spikes during peak loads. The fin profile improves heat transfer by increasing the surface area for heat dissipation and reducing the resistance of air-flow.
The ATS-19B-173-C1-R0 also features a unique clamping mechanism to securely mount the heat sink onto the component. The clamps are adjustable to fit standard and custom mounting configurations and accommodates a range of component heights. The configuration of the ATS-19B-173-C1-R0 also allows for easy installation and removal, as well as flexibility in terms of angle and direction.
The ATS-19B-173-C1-R0 also features an advanced heatpipe cooling system. This system utilizes heat pipes to efficiently move heat away from the source and quickly dissipate it to the other elements of the heat sink. This helps to keep the components cooler and allows for maximum performance during long periods of use.
The ATS-19B-173-C1-R0 is an excellent choice for a variety of thermal management solutions, providing superior heat transfer efficiency and optimal overclocking performance. Its unique shape and clamping mechanism enable installation onto a wide variety of components, while its advanced heatpipe cooling system helps to keep the components cool and ensure maximum performance.
The specific data is subject to PDF, and the above content is for reference