| Allicdata Part #: | ATS31446-ND |
| Manufacturer Part#: |
ATS-19B-178-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-178-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a key component of any electronic system, as it has a significant impact on its performance and reliability. Heat sinks are often used to dissipate the heat generated by electronic systems and components. The ATS-19B-178-C2-R0 is a very popular heat sink solution in a wide range of applications. In this article, we will discuss the application field and working principle of this heat sink.
The ATS-19B-178-C2-R0 heat sink is specifically designed for use in high power applications, such as laser power supplies, RF amplifiers, IT systems, and switching mode power supplies. It has a high thermal resistance of 0.156 °C/W which allows it to effectively cool down electronic components. It also has an excellent dielectric strength rating of 5 GV/m, making it highly resistant to electrical breakdowns. It is a lightweight yet rugged heat sink, with a weight of just 8 kg, making it ideal for applications that require portability or mounting in tight spaces.
The working principle of the ATS-19B-178-C2-R0 heat sink is based on convection cooling. The heat from the electronic components is dissipated through the heat sink via the convection cooling process. Heat is generated in the device due to thermal resistance, which causes the air molecules around it to rise and create an airflow. This airflow cools the components by transferring the heat away from them. The convection cooling process is enhanced by the presence of the fins on the heat sink’s surface, which provide greater surface area for air to pass over.
The ATS-19B-178-C2-R0 heat sink is an effective and reliable cooling solution for a wide range of applications. It can effectively dissipate heat from very high power electronics, enabling them to operate at optimum efficiency. It is a lightweight, rugged, and reliable heat sink that can operate in temperatures ranging from -20 to +85°C and has a dielectric strength of up to 5 GV/m. In summary, the ATS-19B-178-C2-R0 heat sink is an ideal solution for any application that requires efficient cooling of power electronics.
The specific data is subject to PDF, and the above content is for reference