ATS-19B-188-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19B-188-C1-R0-ND

Manufacturer Part#:

ATS-19B-188-C1-R0

Price: $ 3.66
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19B-188-C1-R0 datasheetATS-19B-188-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.32892
30 +: $ 3.23862
50 +: $ 3.05878
100 +: $ 2.87885
250 +: $ 2.69892
500 +: $ 2.60896
1000 +: $ 2.33906
Stock 1000Can Ship Immediately
$ 3.66
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.65°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are necessary for many high-performance electronics, which makes ATS-19B-188-C1-R0 heat sinks ideal for those applications. This thermal-managed component is designed to not only dissipate heat from sensitive electronic components within an enclosure, but to also ensure a safe and efficient temperature for optimal performance. The ATS-19B-188-C1-R0 is a compact heat sink which utilizes aluminum fins to provide excellent thermal properties with a low profile. The fins are designed to maximize the surface area for heat dissipation, resulting in highly efficient thermal transfer.

ATS-19B-188-C1-R0 heat sinks are designed with versatility in mind. The heat sink’s size, shape, and construction allow for easy installation in almost any environment. The aluminum material can also be modified with a variety of anodized finishes and custom color options. This thermal management product can be custom designed to fit any application, and its low profile design enables a higher density of components to be accommodated in very tight spaces. This makes it an ideal choice for a variety of industries, from consumer electronics to military and aerospace applications.

The working principle of ATS-19B-188-C1-R0 heat sinks is based on the idea of thermal transfer. Heat is dissipated from the fins of the heat sink to the ambient air, which in turn dissipates the heat away from the electronic components. The heat sink design is optimized to give efficient thermal transfer by maximizing the surface area of the fins. This works in conjunction with the cooling fan (if any) and other components like a heat spreader to provide an efficient thermal transfer solution.

ATS-19B-188-C1-R0 heat sinks are designed to provide optimal performance while remaining cost-effective. This product is ideal for applications where thermal transfer needs to be improved. The low profile nature of the heat sink enables it to be implemented in more confined spaces and given its various configurations, it is possible to fit it into practically any environment. The versatility of the product makes it an ideal choice for many thermal management applications, including military applications.

The ATS-19B-188-C1-R0 thermal management solution is designed to provide efficient and effective cooling in a small profile. The aluminum fins of the heat sink are optimized to maximize the surface area for maximum dissipation. The wide range of finishes and custom color options make this device an ideal choice for many applications. Not only is the ATS-19B-188-C1-R0 heat sink energy efficient and cost-effective, but its versatility makes it an optimal choice for thermal management in a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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