| Allicdata Part #: | ATS-19B-19-C1-R0-ND |
| Manufacturer Part#: |
ATS-19B-19-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-19-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44673 |
| 30 +: | $ 3.25542 |
| 50 +: | $ 3.06394 |
| 100 +: | $ 2.87242 |
| 250 +: | $ 2.68093 |
| 500 +: | $ 2.48943 |
| 1000 +: | $ 2.44156 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks:
The ATS-19B-19-C1-R0 heat sink is an innovative thermal solution designed to improve heat transfer and cooling performance for industrial and electronics applications. It utilizes a unique design featuring a high-efficiency micro-fin heat dissipation plate, which provides an extremely large surface area for improved heat transfer, and a copper tube array that effectively increases liquid flow to quickly wick away heat. The combination of these two features helps maintain long-term thermoelectric stability and prevents overheating. Additionally, the ATS-19B-19-C1-R0 features an array of air channels for improved air flow and improved cooling performance.
The primary application field of the ATS-19B-19-C1-R0 is the cooling of systems and equipment that generate a large amount of heat. Industrial machinery, high-powered electronics, and power supplies all generate significant amounts of heat and require efficient and highly-effective cooling systems. The ATS-19B-19-C1-R0 heat sink is specifically designed to address this need by transferring heat away from the system and into the environment. The heat dissipator plate’s large surface area and copper tube array efficiently promote heat transfer, while the air channeling provides further cooling potential.
In terms of working principle, the ATS-19B-19-C1-R0 acts as a heat sink, absorbing and dissipating heat from the components that are attached to it. Heat generated from these components is transmitted to the heat sink, where it is absorbed and then transferred away from the component and optimally dispersed into the environment. The heat dissipator plate acts as the main area for heat transfer, while the copper tube array and air channels help ensure that the heat transfer is as efficient and effective as possible. The resulting enhancement in cooling performance helps maintain long-term thermoelectric stability and prevents overheating of electronics or industrial applications.
In conclusion, the ATS-19B-19-C1-R0 Heat Sink is an excellent thermal solutions for applications that require efficient and effective cooling. Its unique micro-fin heat dissipation plate and copper tube array work together to provide superior heat transfer, while its air channeling ensures optimal cooling performance. The result is a system that can maintain long-term thermoelectric stability and completely prevent overheating, thus ensuring a more reliable and efficient operation for industrial and electronics applications.
The specific data is subject to PDF, and the above content is for reference