| Allicdata Part #: | ATS-19B-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-19B-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are becoming increasingly important in today\'s electronic devices, due to their ability to regulate electronic components to keep them cool and running at optimal performance. The ATS-19B-197-C3-R0 thermal management solution is a heat sink specifically designed to effectively dissipate heat from sensitive electronic components.
The ATS-19B-197-C3-R0 features a low-noise, fanless, high-capacity thermal solution, with a wide range of sizes and styles available. It combines an efficient metal base plate with a minimized fin structure for superior heat dissipation. The fins are precision-machined to provide maximum heat dissipation and provide an ideal combination of efficiency and cost. This feature makes it a great option for any application where heat dissipation is needed.
The ATS-19B-197-C3-R0 utilizes a high-quality extruded aluminum heat sink with a black anodized finish, designed to provide superior strength and durability. The design features an advanced low-profile design which allows for easy installation inside electronic devices. The heat sink is most effective when attached to the device\'s processor component or other sensitive areas, but can also be installed onto flat surfaces to further improve its cooling performance.
The ATS-19B-197-C3-R0\'s working principle is based on natural convection. Heat is transferred from the heat source (processor, chipset, etc.) through the baseplate, and then dissipated into the surrounding air through the fin structure of the heat sink. As the air flows through the fins of the heat sink, the heat is dissipated as the air spirals outward from the heat source. The air is cooled, and the heat removed from the device, helping to ensure its optimal performance.
The ATS-19B-197-C3-R0 is an ideal thermal management solution for a variety of applications, including computers, laptops, gaming consoles, and other electronics that require efficient heat dissipation. With its low profile design, it can easily be installed into most devices without taking up too much space. Additionally, the anodized aluminum construction ensures strength and durability, making it an excellent choice for all your thermal management needs.
The specific data is subject to PDF, and the above content is for reference