Allicdata Part #: | ATS-19B-20-C1-R0-ND |
Manufacturer Part#: |
ATS-19B-20-C1-R0 |
Price: | $ 3.99 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-19B-20-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.62061 |
30 +: | $ 3.41922 |
50 +: | $ 3.21817 |
100 +: | $ 3.01701 |
250 +: | $ 2.81588 |
500 +: | $ 2.61474 |
1000 +: | $ 2.56446 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal management is critical to the success of many applications. To help alleviate the harsh environment generated when heat is generated during the operations of electronic systems, heat sinks are extremely important components. The ATS-19B-20-C1-R0 is a type of heat sink that can be used for a wide variety of applications. This article will discuss what this heat sink is, what types of applications it is suited for, and its working principles.
ATS-19B-20-C1-R0 is a heat sink with a super slim form factor that is designed for integration into many types of applications. The heat sink is made up of an aluminum core with a copper coating. It also features an outer shell made of sheet aluminum. It has a thermal resistance of 0.26°C/W and a power dissipation capacity of 8.3 W. This heat sink features high thermal conductivity and thermal resistance making it an ideal solution for electronic systems where space is limited and some parts generate excess heat.
This type of heat sink is suitable for applications that require a low profile and where the heat generated by the application needs to be dissipated quickly and efficiently. This includes applications in the areas of consumer electronics, medical devices, LED lighting, automotive electronics, and server systems. When using the ATS-19B-20-C1-R0 as part of an application, it is important to consider the type of ambient air ventilation available when using the unit. For most applications, positive air pressure with an adequate air circulating system is encouraged for optimal performance.
The working principle of the ATS-19B-20-C1-R0 is based on the transfer of heat out of the source and into the heat sink. This is done by providing the heat sink with a larger thermal mass than the source, which creates a temperature gradient between the two. Heat is transferred from the source component to the heat sink via convection, conduction, or radiation. Once the heat is absorbed by the heat sink, it is then dissipated into the surrounding environment.
In conclusion, the ATS-19B-20-C1-R0 heat sink is an essential component when considering applications in which excessive heat must be managed. The heat sink’s slim form factor and high thermal conductivity make it an ideal solution for many applications where space is limited or temperature extremes are present. Its working principle is based on the transfer of heat out of the source component into the heat sink and thence into the ambient environment.
The specific data is subject to PDF, and the above content is for reference