| Allicdata Part #: | ATS-19B-37-C2-R0-ND |
| Manufacturer Part#: |
ATS-19B-37-C2-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-37-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19B-37-C2-R0 is a product of thermal management. Specifically, it is a heat sink device used to dissipate heat generated by electrical devices and provide cooling conditions in electronics applications. Heat sinks are typically used in electronics such as computers and consumer electronics to ensure proper operation and allow parts to not operate at excessive temperatures. The ATS-19B-37-C2-R0 has several unique features that make it ideal for thermal management applications.
First, the ATS-19B-37-C2-R0 is engineered with a unique design that allows it to handle high thermal loads. It is constructed using aluminum fins which have been precision machined for maximum surface area configuration. This increases the surface area of the device, allowing it to more effectively dissipate heat from electrical components. The fins also feature two-tiered fin cross section which ensures higher heat transfer performance.
Second, the ATS-19B-37-C2-R0 has a very low resistance to air flow. This allows the heat sink to operate at its lowest possible resistance to air flow, decreasing the amount of energy that must be expended in order to cool the device. This feature ensures optimal heat evacuation performance and provides maximum cooling efficiency. Furthermore, the low resistance to air flow allows the ATS-19B-37-C2-R0 to operate at lower fan speeds, which decreases the amount of vibration and noise generated by the device.
The third feature of the ATS-19B-37-C2-R0 is its ability to be mounted in a variety of orientations. The device can be mounted horizontally, vertically, or in an almost infinite combination of angles and orientations. This flexibility allows it to be mounted wherever desired in order to maximize cooling efficiency and vaporize the heat away.
Overall, the ATS-19B-37-C2-R0 is an example of the latest technological advancements in the field of thermal management. Its unique design features allow it to handle high thermal loads and provide maximum cooling performance. It is highly efficient and can be mounted in a number of different orientations to ensure maximum cooling efficiency. It is also extremely quiet and vibration-free, ensuring that it does not disturb the normal operation of electronic components. All of these features make the ATS-19B-37-C2-R0 an excellent choice for any type of electronic application requiring thermal management.
The specific data is subject to PDF, and the above content is for reference