| Allicdata Part #: | ATS-19B-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-19B-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks relate to controlling the temperature of electronics and preventing them from being damaged. This is achieved through the transfer of heat from the components to a surrounding environment, such as air or water. The ATS-19B-63-C1-R0 is a thermal-heat sink designed to fit a variety of electronic components. It is made from a combination of aluminum and copper for better heat dissipation.
The ATS-19B-63-C1-R0 is an effective heat sink because it is capable of transfer heat from the electronics through its design. It is designed with multiple channels to suit different electronics components for a better heat transfer. Its base plate is made of aluminum and is connected to multiple fin layers to dissipate heat away from those components and to the atmosphere. In conjunction with its copper design, the combination produces an efficient combination of low thermal resistance and excellent heat transfer.
The working principle of ATS-19B-63-C1-R0\'s heat sink is the transfer of heat from the base plate to the aluminum fins. This is achieved through a combination of convection, radiation, and conduction. Convection is the movement of air or liquid over a heated surface, while radiation is the transfer of heat energy without the need of a medium. Conduction is the transfer of heat within a solid material. Heat leaves the base plate and enters the fins, which are much cooler. The fins then absorb the heat and dissipate it to the atmosphere through convection and radiation.
The application field of the ATS-19B-63-C1-R0 includes a variety of components that need a reliable heat sink solution. It is designed for both active and passive cooling and can be used in computers, servers, communication systems, home electronics, and automobiles. It is also suitable for industrial applications such as laser-welding machines, X-ray machines, and electronic instruments.
The ATS-19B-63-C1-R0 Thermal - Heat Sink offers an effective and reliable way to protect electronic components from over-heating. The combination of aluminum and copper improves the performance of the heat sink, allowing it to effectively dissipate heat away from the components. This allows longer life spans of components as heat damage is prevented. The ATS-19B-63-C1-R0 is suitable for many applications and provides an effective way to ensure the reliability of electronic components.
The specific data is subject to PDF, and the above content is for reference