| Allicdata Part #: | ATS-19B-80-C1-R0-ND |
| Manufacturer Part#: |
ATS-19B-80-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-80-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-heat sinks are one of the most important components of any electronic system. They play a pivotal role in ensuring the overall stability and performance of the system, and in the case of the ATS-19B-80-C1-R0 thermal-heat sink, the functionality is even more important. This item is specifically designed for an extremely wide range of electronic and industrial applications.
The ATS-19B-80-C1-R0 thermal-heat sink is a unique product that utilizes technology to enable fast heat dissipation and efficient thermal regulation. This design enables the product to be used in a wide range of thermal management applications. The performance and overall design of this thermal-heat sink make it an ideal choice for application fields including process control systems, medical instruments, industrial automation, and all other instances where efficient temperature regulation is required.
The ATS-19B-80-C1-R0 thermal-heat sink features a flange-mounted design with a solid copper base. The sink is equipped with a precision-machined fin stack, which helps to dissipate heat quickly and efficiently. This optimized fin array ensures maximum performance from the unit and contributes to the overall performance of the system.
The ATS-19B-80-C1-R0 thermal-heat sink is constructed from a special laminate, which is designed to minimize thermal resistance. The design provides superior performance over conventional aluminum or copper-based heat sinks, and it is designed to operate at high-temperature levels and long-term use. The robust construction makes this unit a suitable choice for high-performance thermal management applications.
The ATS-19B-80-C1-R0 thermal-heat sink is designed to operate efficiently in a wide range of conditions. This includes low as well as high temperatures, and it is suitable for both indoor and outdoor applications. The unit is designed for operation in cases where there is space limitation, and this makes it an ideal choice for use in industries with limited space.
The working principle of the ATS-19B-80-C1-R0 thermal-heat sink is based on the thermal conduction process. This process transfers the heat generated by the electronic components to the heat sink, and it is facilitated by the aluminum heat sink fin array. The aluminum heat sink is designed to absorb the heat, and as the temperature is increased, the heat is dissipated more quickly.
The ATS-19B-80-C1-R0 thermal-heat sink is an efficient and reliable thermal management solution for a variety of applications. The design allows for fast heat dissipation, efficient thermal regulation, and reliable operation in extreme conditions. The unit is also cost-effective, making it an ideal choice for cost-sensitive applications. This product is suitable for a range of electronic and industrial applications and is suitable for applications in harsh environments as well.
The specific data is subject to PDF, and the above content is for reference