| Allicdata Part #: | ATS-19B-85-C1-R0-ND |
| Manufacturer Part#: |
ATS-19B-85-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19B-85-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays a key role in the reliability and performance of many electronic devices. The availability of efficient thermal management components is essential in order to ensure the safe operation of the device. The ATS-19B-85-C1-R0 heat sink is one such component that can be used to effectively distribute and dissipate the heat generated by an electronic component.
The ATS-19B-85-C1-R0 heat sink is a thermally-efficient finned heat sink, designed for optimal performance under high input power conditions. It is constructed out of high quality aluminum and features a rugged construction that ensures it can withstand temperatures in excess of 200°C. The fins of the heat sink are designed to maximise heat dissipation while minimising the overall heat transfer resistance. The ATS-19B-85-C1-R0 is designed to be used in applications where high power levels and compact thermal solution are required such as surface mount LEDs, power electronic and power supply applications.
This heat sink is especially suited to applications requiring the removal of heat from high power components that require a solution that is relatively low in cost. The ATS-19B-85-C1-R0 heat sink is easy to install and provides a reliable and efficient thermal solution for a variety of applications. The thermal resistance of the heat sink is low and it can dissipate up to 40 Watts of thermal energy. The unit is made from extruded aluminum, anodized and powder coated for durability and surface finish. It can be mounted to a flat surface for optimal performance and convenience.
The ATS-19B-85-C1-R0 heat sink is designed to operate by using air-cooling techniques. An air-flow is created by natural convection and the fins of the heat sink act to increase the surface area of the component so the heat dissipates at a faster rate. The increased surface area increases the power dissipation from the heat sink by allowing more air to flow through the unit. The fins also act as a natural impediment to the progress of the air flow, making it take longer for heat to escape from the component.
The ATS-19B-85-C1-R0 heat sink is designed to be used with components that generate large amounts of heat. The unit is suitable for both thermal management and structural support for components that operate in extreme thermal environments. The low profile of the unit means it is suitable for applications with limited space. The high thermal efficiency of the heat sink means the component can operate at higher temperatures and provide better performance than traditional heat sinks.
The ATS-19B-85-C1-R0 heat sink is an ideal choice for applications requiring a reliable and efficient thermal management solution. The unit is a cost effective solution for dissipating the heat generated by components in high power applications. The high thermal efficiency of the unit ensures a long service life and good performance. The unit is easy to install and can be mounted to any flat surface.
The specific data is subject to PDF, and the above content is for reference