| Allicdata Part #: | ATS-19C-01-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-01-C3-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-01-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.10779 |
| 30 +: | $ 3.02379 |
| 50 +: | $ 2.85566 |
| 100 +: | $ 2.68771 |
| 250 +: | $ 2.51975 |
| 500 +: | $ 2.43576 |
| 1000 +: | $ 2.18378 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal components that shunts the heat generated by electrical or mechanical components. By dissipating excess heat away from the component, temperatures can be maintained within their safe operating range. Heat sinks are commonly used in conjunction with CPU and GPU cores, thermal protection systems, and power transistors. The ATS-19C-01-C3-R0 heat sink is a cost-effective solution that provides thermal management for a variety of applications.
The ATS-19C-01-C3-R0 is a basic aluminum heat sink with a flat base with high thermal conductivity. The heat sink can be attached directly to the component using metal mounting clips or by using thermal adhesive tape or thermal compound. The ATS-19C-01-C3-R0 is capable of dissipating up to 5W of heat from a device. The heat sink is 19mm high, 41mm wide, and 32.5mm long.
The ATS-19C-01-C3-R0 is commonly used in electronics applications where heat dissipation needs to be addressed. Examples include power supplies, automotive electronics, telecommunication systems, solar inverters, UPS systems, and industrial equipment. It is also suitable for use in LED lighting systems, medical devices, and aviation applications.
The ATS-19C-01-C3-R0 is designed to facilitate heat transfer from the component to atmosphere. Heat generated by the component is transferred via conduction to the heat sink where it is dissipated as convection to the surrounding environment. This type of heat sink is also designed to be lightweight, cost-effective, and efficient in operation. The design of the ATS-19C-01-C3-R0 heat sink allows it to efficiently transfer heat away from the component and increase the efficiency of the system.
The ATS-19C-01-C3-R0 heat sink features a special construction which features an anodized surface that helps to enhance the thermal performance of the component. An anodized surface is a layer of tightly bonded oxide which helps to reduce the surface area exposed to air and helps to maintain an even heat distribution. The anodized surface also helps to enhance the power dissipation of the device and reduce the risk of electrical shorts.
The ATS-19C-01-C3-R0 heat sink is designed to provide cost-effective and efficient heat dissipation from a variety of electronic devices and components. By dissipating excess heat away from the component, temperatures can be maintained within their safe operating range. The heat sink is designed for use in commercial and industrial applications where reliability and thermal performance are paramount.
The specific data is subject to PDF, and the above content is for reference