Allicdata Part #: | ATS-19C-139-C1-R0-ND |
Manufacturer Part#: |
ATS-19C-139-C1-R0 |
Price: | $ 3.12 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X20MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-19C-139-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 2.80161 |
30 +: | $ 2.72601 |
50 +: | $ 2.57443 |
100 +: | $ 2.42304 |
250 +: | $ 2.27161 |
500 +: | $ 2.19588 |
1000 +: | $ 1.96871 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-19C-139-C1-R0 is a type of thermal heat sink. It is an efficient heat exhaust system that is used to dissipate heat from electrical components. The thermal heat sink is made up of a central, solid metal block which is designed to absorb and dissipate heat from the attached electrical components. This is done by utilizing metal fins that are designed to draw heat away from the components and increase the surface area for maximum heat dissipation.
The heat sink features a set of fins composed of copper, aluminum or other metal materials which provides excellent thermal conductivity. This helps to create a large surface area which helps transfer heat away from the components quickly. These fins are also designed to increase the surface area to decrease the chances of the heat being recirculated. The fins are arranged in such a way as to maximize both the strength and efficiency of the heat sink.
In order to ensure that the heat sink efficiently dissipates heat, it must be attached securely to the components it is dissipating heat from. It is also important to ensure that the metal fins are in contact with the component surfaces, as this is what increases the surface area for maximum heat dissipation. In order to do this, the fins are spaced out so they are as close as possible to the components being cooled.
Due to its efficient heat dissipation, the ATS-19C-139-C1-R0 thermal heat sink is an ideal solution for use in a range of applications, such as in electronic devices, data centers, semiconductors, automotive electronics, and other high-performance electronics. This type of heat sink is a great choice for those looking for an efficient cooling solution to help extend the life of their electronics and save energy.
The ATS-19C-139-C1-R0 thermal heat sink can be used in various electrical applications, including CPUs, GPUs, RAM, FPGA, and other components in a variety of electronic devices. This type of heat sink is also a great choice for those looking to increase the lifespan of their electronics. The thermal heat sink helps to ensure that the components stay at a stable temperature, thus reducing the chances of overheating and consequent damage.
The ATS-19C-139-C1-R0 thermal heat sink is designed to work with a wide range of voltages and currents, allowing it to be used with various types of components. Additionally, its low profile and lightweight design make it durable and easy to install in many types of electronic devices. It is also noted for being able to operate in temperatures that are both low and high.
Overall, the ATS-19C-139-C1-R0 thermal heat sink is an excellent choice for those looking for an efficient cooling solution. With its efficient heat dissipation and solid construction, it provides a great option for helping to extend the life of electronics and save energy. Thanks to its low-profile, lightweight construction, it is easy to install in a wide range of electronic devices and helps ensure components stay at a stable temperature for optimal performance.
The specific data is subject to PDF, and the above content is for reference