| Allicdata Part #: | ATS-19C-16-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-16-C3-R0 |
| Price: | $ 4.07 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-16-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.69936 |
| 30 +: | $ 3.49398 |
| 50 +: | $ 3.28835 |
| 100 +: | $ 3.08291 |
| 250 +: | $ 2.87736 |
| 500 +: | $ 2.67183 |
| 1000 +: | $ 2.62044 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for the proper functioning of electronic devices. Heat sinks are used to dissipate excess heat produced by electronic components due to their operation. ATS-19C-16-C3-R0 is a type of thermal solution that is used in various applications. This thermal solution is used to dissipate heat from the components in power systems, communications, aerospace, medical systems, and other applications.
Design and Construction
ATS-19C-16-C3-R0 is a finned aluminum extrusion-style heat sink which is formed from a single piece of aluminum material. This heat sink has a fin width of 0.166" and length of 4.00". It can dissipate heat up to 400 watts using 55CFM of air flow. The heat sink features two plated mounting brackets, which can be used to attach other components. The heat sink is coated with a black anodized finish to enhance its strength and make it corrosion-resistant. In addition, it has a thermal tape which further helps with heat dissipation.
Compatibility with Components
The ATS-19C-16-C3-R0 heat sink is compatible with most types of thermoelectric components. This allows users to customize to their required specifications. It is compatible with TO-220, DIP, and SOT-23 devices. The heat sink is also compatible with various types of fans, such as 40mm, 60mm, 80mm, and 120mm fans. The thermal solution is also compatible with copper and aluminum heatsinks. The heat sink can also be mounted onto boards using a hole-mounted mounting bracket. The heat sink can also be used with PCBs that have a hole size of 19mm.
Operation and Performance
The ATS-19C-16-C3-R0 thermal solution can be used to dissipate low-frequency heat generated by components. The heat generated is transferred away from the component to the aluminum material, which is then dissipated away from the component. The two plated mounting brackets provide stability and maintain the heat sink securely in place. The anodized finish helps to prevent corrosion and improves the overall performance of the heat sink. The heat sink is also compatible with fans, which can be incorporated to improve cooling performance. The fans help to increase the air flow, thus providing more effective cooling.
Conclusion
In conclusion, the ATS-19C-16-C3-R0 thermal solution is an effective way of managing heat generated by components. It is designed for low-frequency applications and is compatible with various components. The heat sink features an anodized finish and is mounted securely in place with the two plated mounting brackets. Moreover, the thermal solution can be used with fans to improve its cooling performance. The ATS-19C-16-C3-R0 thermal solution is thus ideal for applications requiring efficient thermal management.
The specific data is subject to PDF, and the above content is for reference