Allicdata Part #: | ATS-19C-167-C1-R0-ND |
Manufacturer Part#: |
ATS-19C-167-C1-R0 |
Price: | $ 3.12 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X20MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-19C-167-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 2.80161 |
30 +: | $ 2.72601 |
50 +: | $ 2.57443 |
100 +: | $ 2.42304 |
250 +: | $ 2.27161 |
500 +: | $ 2.19588 |
1000 +: | $ 1.96871 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Introduction
The ATS-19C-167-C1-R0 is a powerful heat sink, designed to dissipate the large amounts of heat created by sensitive electronic components while ensuring steady performance over a long period of time. It is highly effective at cooling a variety of components, and has a wide range of uses. In this article, we will explore the application field for the ATS-19C-167-C1-R0, as well as the working principles behind it.
Application Field
The ATS-19C-167-C1-R0 is ideal for cooling computer CPUs, GPU, chipset and RAM, as well as for cooling a variety of power supply components. It is also well-suited for cooling down any electronic devices, such as mobile phones, tablets, smart watches and other wearables. With its aluminum-based design, it is even capable of cooling down high-powered industrial components, such as switches, motors, and transformers. The design is versatile enough that it can also be used as an effective cooling component for sensitive audio and video equipment.
Working Principle
The ATS-19C-167-C1-R0 utilizes a combination of forced-air convection and active heat pipe cooling to dissipate the large amounts of heat created by electronic components. Forced-air convection uses a powerful fan to draw in cooling air and blow it directly onto the components. This helps to actively cool the electronics, reducing their operating temperatures and assisting in their overall performance.
The heat pipes also use convection and forced-air cooling to dissipate heat. They contain evaporated coolant, which has a low boiling point and evaporates quickly. This causes the coolant to absorb heat from the components and quickly move it away, transferring it to the heat sinks for dissipation. The sustained process of removing generated heat from the components ensures excellent cooling performance and enhances the longevity of the components.
Conclusion
The ATS-19C-167-C1-R0 is a powerful heat sink, designed to dissipate the large amounts of heat created by sensitive electronic components while ensuring steady performance over a long period of time. It is highly effective at cooling a variety of components, as well as electronic devices, computers, industrial components, and audio and video equipment. The heat sink utilizes a combination of forced-air convection and active heat pipe cooling to cool down components, allowing for efficient heat dissipation and an extended lifespan for the components.
The specific data is subject to PDF, and the above content is for reference