| Allicdata Part #: | ATS31649-ND |
| Manufacturer Part#: |
ATS-19C-182-C2-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-182-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.84930 |
| 10 +: | $ 3.74787 |
| 25 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to manage the thermal energy of an electronic component or system. The ATS-19C-182-C2-R0 is one such heat sink model that offers features, benefits, and a wide range of applications.
The ATS-19C-182-C2-R0 is a low-profile and lightweight heat sink constructed with aluminum. It offers excellent thermal conductivity of 8.8 W/mK and superior durability thanks to its anodized protective coating. Its "C" shaped design allows for enhanced airflow and improved convection heating performance by providing multiple sides for air to enter. The heat sink mounting hardware is included to make installation easy.
The ATS-19C-182-C2-R0 is suitable for a wide range of applications, including embedded systems, communications, electronics, industrial automatic control, consumer electronics, and medical equipment. Its features also make it suitable for projects that require small spaces and need efficient thermal management. This heat sink can also be used in computers, laptops, and servers as an effective cooling solution.
The working principle of the ATS-19C-182-C2-R0 is based on thermodynamics and heat transfer. The thermal energy is dissipated to the surrounding environment by conduction, convection, and radiation. The heat of the electronic component flows through the heat sink which absorbs the heat and disperses it into the environment. The thermodynamics of the heat sink as well as its design and material affects the efficiency of this process. The air inside the enclosure and the surface area of the heat sink also play a part in the thermal transfer process.
The effectiveness of the ATS-19C-182-C2-R0 heat sink can be further improved by adding additional features such as fans or other components. Fans provide additional air flow which help dissipate the heat even more effectively as more air enters the system. Other components like thermal paste can also be used to reduce the thermal resistance between the heat sink and the electronic component, allowing more efficient heat transfer.
In conclusion, the ATS-19C-182-C2-R0 is a useful heat sink model with excellent features that offer a wide range of applications. Its thermodynamics and heat transfer working principle make it an efficient thermal management solution for many electronics projects. By combining it with other components, this heat sink can be further customized for the specific needs of each project.
The specific data is subject to PDF, and the above content is for reference