ATS-19C-200-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.76°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are available in various types to accommodate different application requirements. There are many types of heat sinks with various features and applications. ATS-19C-200-C1-R0 is one of the many types of heat sinks produced by ATS, it is a heatsink, with a small footprint and low profile, designed for maximum heat transfer and ease of installation in electronic equipment.

Application Field

The ATS-19C-200-C1-R0 heat sink is commonly used in a variety of electronic applications such as AC/DC drivers, DC motor controllers, and camera modules. It is also a preferred solution in small form factor applications such as cellular phones, laptop computers, and other devices that require a small footprint and a low profile. The unique design of the heat sink maximizes airflow and promotes uniform cooling of the electronics integrally mounted on it. In addition, the ATS-19C-200-C1-R0 is also suitable for applications that require maximum heat dissipation in a limited space. Thanks to its compact size, the heat sink can be easily mounted onto the device without occupying too much valuable space.

Working Principle

The ATS-19C-200-C1-R0 heat sink employs a unique design that maximizes heat transfer. The heat sink basically consists of a flat top surface and a highly conductive aluminum base. The flat top surface is designed with grooves along the length of its surface to increase the amount of surface area exposed to the ambient air. This phenomenon is known as convection, which cools the internal device. The aluminum base of the ATS-19C-200-C1-R0 provides the main thermal transfer of the heat sink. Heat is generated within the integrated component and the aluminum base conducts it away from the source of heat. Additionally, the top flat surface of the heat sink helps increase the surface area exposed to the ambient air, further aiding in the thermal transfer process.

Conclusion

The ATS-19C-200-C1-R0 heat sink is one of the many models of heat sinks available for electronic applications. This type of heat sink is popular due to its small size, low profile and efficient thermal performance as compared to other models. The unique design of the ATS-19C-200-C1-R0 promotes uniform cooling by combining convection and conduction concepts. The convection process on the top surface helps remove the heat generated from the integrated electronic component, while the conduction process on the stainless steel base ensures the thermal transfer away from the source of heat.

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