| Allicdata Part #: | ATS-19C-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-200-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42531 |
| 30 +: | $ 3.33291 |
| 50 +: | $ 3.14773 |
| 100 +: | $ 2.96264 |
| 250 +: | $ 2.77745 |
| 500 +: | $ 2.68487 |
| 1000 +: | $ 2.40712 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-19C-200-C3-R0 thermal heat sink is a type of heat dissipation device used to transfer thermal heat away from sensitive components. It works by absorbing the heat energy from the device and dissipating it to the surrounding air. This allows the device to remain cool and to operate efficiently. The heat sink has a variety of applications in the electronic industry and is commonly used in communications, computer, power semiconductors, and electronics equipment.
Application Field
The ATS-19C-200-C3-R0 thermal heat sink is widely used in electronic devices. It is an essential component in power semiconductors, such as transistors, rectifiers, and switches. It is also used in communications equipment, such as radio transceivers, routers, and other mobile devices. Additionally, it is used in computers, including mainframes, laptops, and desktops. It is also used in high-end electronics equipment, such as radio frequency (RF) circuit boards, power supply converters, and amplifiers. Finally, it is also used in other applications, such as power dissipaters, motor drivers, and LEDs.
Design Features
The ATS-19C-200-C3-R0 thermal heat sink is constructed out of an extruded aluminum material, which offers an excellent thermal conductivity. The aluminum material is also corrosion resistant, which allows it to last longer and perform better. The heat sink has a finned design, which allows for a larger heat transfer surface area to dissipate heat more efficiently. Additionally, the heat sink has a highly compact design, which makes it easy to install in a variety of environments, even small spaces. It also has an ultra-low profile design, which reduces its weight and makes it easier to install.
Working Principle
The ATS-19C-200-C3-R0 thermal heat sink works by transferring heat energy from the device to the surrounding air. This is achieved by combining a high thermal conductivity materials with a high heat transfer surface area. The heat sinks fins are designed to absorb the heat energy and transfer it away from the device, where it is dissipated to the surrounding air. This ensures that the device stays cool and operates efficiently. The heat energy absorbed by the heat sink is also dissipated to the environment, where it is released as thermal energy.
Conclusion
In conclusion, the ATS-19C-200-C3-R0 thermal heat sink is a highly efficient and reliable device used to dissipate heat energy away from electronic devices. It is used in a variety of applications, including power semiconductors, communications, computers, and high-end electronics equipment. The heat sink has a finned design, which increases its thermal conductivity and allows for a larger heat transfer surface area. Additionally, the heat sink has an ultra-low profile design, which reduces its weight and makes it easier to install. It works by combining a high thermal conductivity materials with a high heat transfer surface area to absorb heat energy and transfer it away from the device.
The specific data is subject to PDF, and the above content is for reference