| Allicdata Part #: | ATS-19C-204-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-204-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-204-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55068 |
| 30 +: | $ 3.35328 |
| 50 +: | $ 3.15605 |
| 100 +: | $ 2.95880 |
| 250 +: | $ 2.76154 |
| 500 +: | $ 2.56429 |
| 1000 +: | $ 2.51498 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a key consideration for most electronic systems. The proper selection and design of a thermal management solution for a specific application can have a significant impact on system reliability. Thermal-Heat Sinks are used to dissipate heat from components in an electronic system. A common example of this is a cooling fan, which is used to expel hot air from the device. The ATS-19C-204-C3-R0 is a particular type of thermal-heat sink designed to absorb and dissipate heat from components such as transistors, capacitors, and integrated circuits.
The ATS-19C-204-C3-R0 heat sink is a Clip-On type optimized for high-current applications. It is constructed from high-performance aluminum alloy which gives it an optimal balance between efficient dissipation of heat and low weight. This heat sink is designed for use in applications such as power supply, high-frequency switching, audio and video equipment, and other applications which require efficient thermal management. The clip-on design makes the ATS-19C-204-C3-R0 very easy to install and maintain, while the optimized design ensures that it can effectively handle the thermal requirements of the application.
The ATS-19C-204-C3-R0 thermal-heat sink is designed to dissipate heat from the surface of the component on which it is installed. It utilizes an internal fin structure to increase the surface area, which allows the heat to be efficiently absorbed and dissipated. The fin structure also increases the fan noise, resulting in a quieter cooling solution. Additionally, the aluminum alloy construction of the heat sink helps minimize corrosion, increasing its life span.
The ATS-19C-204-C3-R0 thermal-heat sink uses a combination of airflow and radiative cooling to dissipate heat from the component it is installed on. Airflow cooling is achieved by circulating air around the fins of the heat sink. This air circulation helps to dissipate the heat by cooling the components faster than conventional methods. In addition, the radiative cooling principle of the ATS-19C-204-C3-R0 heat sink helps to further improve the dissipation of the heat. This principle works by reflecting heat away from the components, thus helping to reduce the temperature of the components.
The ATS-19C-204-C3-R0 thermal-heat sink has been designed to provide effective thermal management solutions for applications with high current levels and tight space constraints. The clip-on design ensures easy installation and maintenance, while the optimized fin structure provides high performance and low noise levels. The combination of airflow and radiative cooling allows for efficient thermal efficiency and increased life span. The ATS-19C-204-C3-R0 thermal-heat sink is an ideal solution for applications where thermal management is a key concern.
The specific data is subject to PDF, and the above content is for reference